k4h560838f Samsung Semiconductor, Inc., k4h560838f Datasheet

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... DDR SDRAM 256Mb F-die (x8, x16) 256Mb F-die DDR SDRAM Specification Revision 1.3 October, 2004 DDR SDRAM Rev. 1.3 October, 2004 ...

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... DDR SDRAM 256Mb F-die (x8, x16) 256Mb F-die Revision History Revision 1.0 (June, 2003) - First version for internal review Revision 1.1 (Agust, 2003) - Added x8 org (K4H560838F) and speed AA Revision 1.2 (May, 2004) - Modified IDD current spec. Revision 1.3 (October, 2004) - Corrected typo. DDR SDRAM Rev. 1.3 October, 2004 ...

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... TSOP II package Ordering Information Part No. K4H561638F-TC/LB3 K4H561638F-TC/LAA 16M x 16 K4H561638F-TC/LA2 K4H561638F-TC/LB0 K4H560838F-TC/LB3 K4H560838F-TC/LAA 32M x 8 K4H560838F-TC/LA2 K4H560838F-TC/LB0 Operating Frequencies B3(DDR333@CL=2.5) Speed @CL2 Speed @CL2.5 *CL : CAS Latency Org. Max Freq. B3(DDR333@CL=2.5) AA(DDR266@CL=2) A2(DDR266@CL=2) B0(DDR266@CL=2.5) B3(DDR333@CL=2 ...

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... DDR SDRAM 256Mb F-die (x8, x16) Pin Description DDQ DDQ SSQ SSQ DDQ DDQ SSQ SSQ DDQ DDQ LDQS ...

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... DDR SDRAM 256Mb F-die (x8, x16) Package Physical Dimension #66 #1 (1.50) (0.71) NOTE REFERENCE ASS’Y OUT QUALITY #34 #33 22.22±0.10 (10×) 0.65TYP 0.30±0.08 0.65±0.08 (10×) 66pin TSOPII / Package dimension DDR SDRAM Units : Millimeters (10×) (10×) +0.075 0.125 -0.035 0.10 MAX 0.25TYP [ ] 0.075 MAX 0× ...

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... DDR SDRAM 256Mb F-die (x8, x16) Block Diagram ( 8Mbit 4Mbit Banks) Bank Select CK, CK ADD LCKE LRAS LCBR LWE CK, CK CKE CS x8/x16 CK, CK Data Input Register Serial to parallel x16/x32 4Mx16 / 2Mx32 4Mx16 / 2Mx32 4Mx16 / 2Mx32 4Mx16 / 2Mx32 Column Decoder Latency & ...

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... DDR SDRAM 256Mb F-die (x8, x16) Input/Output Function Description SYMBOL TYPE Clock : CK and CK are differential clock inputs. All address and control input signals are sam- CK, CK Input pled on the positive edge of CK and negative edge of CK. Output (read) data is referenced to both edges of CK. Internal clock signals are derived from CK/CK. ...

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... Burst stop command is valid at every burst length. 8. UDM/LDM sampled at the rising and falling edges of the UDQS/LDQS and Data-in are masked at the both edges (Write UDM/LDM latency is 0). 9. This combination is not defined for any function, which means "No Operation(NOP)" in DDR SDRAM. CKEn-1 CKEn CS ...

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... General Description The K4H560838F / K4H561638F is 268,435,456 bits of double data rate synchronous DRAM organized as 4x 8,388,608 / 4x 4,194,304 words by 4/16bits, fabricated with SAMSUNGcs high performance CMOS technology. Synchronous features with Data Strobe allow extremely high performance up to 333Mb/s per pin. I/O transactions are possible on both edges of DQS. Range of operating frequen- cies, programmable burst length and programmable latencies allow the device to be useful for a variety of high performance memory system applications ...

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... DDR SDRAM 256Mb F-die (x8, x16) DDR SDRAM Spec Items & Test Conditions Operating current - One bank Active-Precharge; tRC=tRCmin; tCK=10ns for DDR200, 7.5ns for DDR266, 6ns for DDR333; DQ,DM and DQS inputs changing once per clock cycle; address and control inputs changing once every two clock cycles. ...

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... DDR SDRAM 256Mb F-die (x8, x16) < Detailed test conditions for DDR SDRAM IDD1 & IDD7A > IDD1 : Operating current: One bank operation 1. Only one bank is accessed with tRC(min), Burst Mode, Address and Control inputs on NOP edge are changing once per clock cycle. lout = 0mA 2 ...

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... B3(DDR333@CL=2.5) IDD0 90 IDD1 125 IDD2P 3 IDD2F 30 IDD2Q 25 IDD3P 35 IDD3N 55 IDD4R 200 IDD4W 190 IDD5 180 Normal 3 IDD6 Low power 1.5 IDD7A 350 32Mx8 (K4H560838F) A2(DDR266@CL=2.0) AA(DDR266@CL=2.0) B0(DDR266@CL=2.5) 90 115 140 135 160 3 1.5 280 16Mx16 (K4H561638F) A2(DDR266@CL=2.0) AA(DDR266@CL=2.0) B0(DDR266@CL=2.5) 90 115 ...

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... DDR SDRAM 256Mb F-die (x8, x16) AC Operating Conditions Parameter/Condition Input High (Logic 1) Voltage, DQ, DQS and DM signals Input Low (Logic 0) Voltage, DQ, DQS and DM signals. Input Differential Voltage, CK and /CK inputs Input Crossing Point Voltage, CK and /CK inputs Notes : 1. VID is the magnitude of the difference between the input level on CK and the input level on /CK. ...

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... DDR SDRAM 256Mb F-die (x8, x16) Overshoot/Undershoot specification for Data, Strobe, and Mask Pins Maximum peak amplitude allowed for overshoot Maximum peak amplitude allowed for undershoot The area between the overshoot signal and VDD must be less than or equal to The area between the undershoot signal and GND must be less than or equal to ...

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... DDR SDRAM 256Mb F-die (x8, x16) AC Timming Parameters & Specifications Parameter Row cycle time Refresh row cycle time Row active time RAS to CAS delay Row precharge time Row active to Row active delay Write recovery time Last data in to Read command Col. address to Col. address delay CL=2 ...

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... DDR SDRAM 256Mb F-die (x8, x16) Parameter Symbol Mode register set cycle time tMRD DQ & DM setup time to DQS DQ & DM hold time to DQS Control & Address input pulse width tIPW DQ & DM input pulse width tDIPW Power down exit time tPDEX Exit self refresh to non-Read command ...

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... DDR SDRAM 256Mb F-die (x8, x16) Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate Delta Slew Rate tDS +/- 0.0 V/ns 0 +/- 0.25 V/ns +50 +/- 0.5 V/ns +100 Table 5 : Output Slew Rate Characteristice (X16 Devices only) Typical Range Slew Rate Characteristic (V/ns) Pullup Slew Rate 1.2 ~ 2.5 Pulldown slew 1.2 ~ 2.5 Table 6 : Output Slew Rate Matching Ratio Characteristics ...

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... DQS will be tran sitioning from High logic LOW previous write was in progress, DQS could be HIGH, LOW, or transitioning from HIGH to LOW at this time, depending on tDQSS maximum of eight AUTO REFRESH commands can be posted to any given DDR SDRAM device. 5. For command/address input slew rate t1.0 V/ns 6. For command/address input slew rate t0.5 V/ns and 1.0 V/ns 7. For CK & ...

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... DDR SDRAM 256Mb F-die (x8, x16) b. Pulldown slew rate is measured under the test conditions shown in Figure 2. Output Figure 2 : Pulldown slew rate test load c. Pullup slew rate is measured between (VDDQ/2 - 320 mV +/- 250 mV) Pulldown slew rate is measured between (VDDQ/2 + 320 mV +/- 250 mV) Pullup and Pulldown slew rate conditions are to be met for any pattern of data, including all outputs switching and only one output switching ...

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... DDR SDRAM Output Driver V-I Characteristics DDR SDRAM Output driver characteristics are defined for full and half strength operation as selected by the EMRS bit A1. Figures 3 and 4 show the driver characteristics graphically, and tables 8 and 9 show the same data in tabular format suitable for input into simulation tools ...

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... DDR SDRAM 256Mb F-die (x8, x16) Pulldown Current (mA) Typical Typical Voltage (V) Low High 0.1 6.0 6.8 0.2 12.2 13.5 0.3 18.1 20.1 0.4 24.1 26.6 0.5 29.8 33.0 0.6 34.6 39.1 0.7 39.4 44.2 0.8 43.7 49.8 0.9 47.5 55.2 1.0 51.3 60.3 1.1 54.1 65.2 1.2 56.2 69.9 1.3 57.9 74.2 1.4 59.3 78.4 1.5 60.1 82.3 1.6 60.5 85.9 1.7 61.0 89.1 1.8 61.5 92.2 1.9 62.0 95.3 2.0 62.5 97.2 2.1 62.9 99.1 2.2 63.3 100.9 2.3 63.8 101.9 2.4 64.1 102.8 2.5 64.6 103.8 2.6 64.8 104.6 2.7 65.0 105.4 Table 7. Full Strength Driver Characteristics Typical Minimum Maximum Low 4.6 9.6 -6.1 9.2 18.2 -12.2 13.8 26.0 -18.1 18.4 33.9 -24.0 23.0 41.8 -29.8 27.7 49.4 -34.3 32.2 56.8 -38.1 36.8 63.2 -41.1 39.6 69.9 -41.8 42.6 76.3 -46.0 44.8 82.5 -47.8 46.2 88.3 -49.2 47.1 93.8 -50.0 47.4 99.1 -50.5 47.7 103.8 -50.7 48.0 108.4 -51.0 48.4 112.1 -51.1 48.9 115.9 -51.3 49.1 119.6 -51.5 49.4 123.3 -51.6 49.6 126.5 -51.8 49.8 129.5 -52.0 49.9 132.4 -52.2 50.0 135.0 -52.3 50.2 137.3 -52.5 50.4 139.2 -52.7 50.5 140.8 -52.8 DDR SDRAM ...

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... DDR SDRAM 256Mb F-die (x8, x16 0.0 Pullup Characteristics for Weak Output Driver 0.0 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 Pulldown Characteristics for Weak Output Driver Figure 4. I/V characteristics for input/output buffers:Pull up(above) and pull down(below) 1.0 2.0 1.0 2.0 DDR SDRAM Maximum Typical High ...

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... DDR SDRAM 256Mb F-die (x8, x16) Pulldown Current (mA) Typical Typical Voltage (V) Low High 0.1 3.4 3.8 0.2 6.9 7.6 0.3 10.3 11.4 0.4 13.6 15.1 0.5 16.9 18.7 0.6 19.6 22.1 0.7 22.3 25.0 0.8 24.7 28.2 0.9 26.9 31.3 1.0 29.0 34.1 1.1 30.6 36.9 1.2 31.8 39.5 1.3 32.8 42.0 1.4 33.5 44.4 1.5 34.0 46.6 1.6 34.3 48.6 1.7 34.5 50.5 1.8 34.8 52.2 1.9 35.1 53.9 2.0 35.4 55.0 2.1 35.6 56.1 2.2 35.8 57.1 2.3 36.1 57.7 2.4 36.3 58.2 2.5 36.5 58.7 2.6 36.7 59.2 2.7 36.8 59.6 Table 8. Weak Driver Characteristics Typical Minimum Maximum Low 2.6 5.0 -3.5 5.2 9.9 -6.9 7.8 14.6 -10.3 10.4 19.2 -13.6 13.0 23.6 -16.9 15.7 28.0 -19.4 18.2 32.2 -21.5 20.8 35.8 -23.3 22.4 39.5 -24.8 24.1 43.2 -26.0 25.4 46.7 -27.1 26.2 50.0 -27.8 26.6 53.1 -28.3 26.8 56.1 -28.6 27.0 58.7 -28.7 27.2 61.4 -28.9 27.4 63.5 -28.9 27.7 65.6 -29.0 27.8 67.7 -29.2 28.0 69.8 -29.2 28.1 71.6 -29.3 28.2 73.3 -29.5 28.3 74.9 -29.5 28.3 76.4 -29.6 28.4 77.7 -29.7 28.5 78.8 -29.8 28.6 79.7 -29.9 DDR SDRAM Pullup Current (mA) Typical Minimum Maximum High -4.3 -2.6 -5.0 -8.2 -5.2 -9.9 -12.0 -7.8 -14.6 -15.7 -10.4 -19.2 -19.3 -13.0 -23.6 -22.9 -15.7 -28.0 -26.5 -18.2 -32.2 -30.1 -20.4 -35.8 -33.6 -21.6 -39.5 -37.1 -21.9 -43.2 -40.3 -22.1 -46.7 -43.1 -22.2 -50.0 -45.8 -22.3 -53.1 -48.4 -22.4 -56.1 -50.7 -22.6 -58.7 -52.9 -22.7 -61.4 -55.0 -22.7 -63.5 -56.8 -22.8 -65.6 -58.7 -22.9 -67.7 -60.0 -22.9 -69.8 -61.2 -23.0 -71.6 -62.4 -23.0 -73.3 -63.1 -23.1 -74.9 -63.8 -23.2 -76.4 -64.4 -23.2 -77.7 -65.1 -23.3 -78.8 -65.8 -23.3 -79.7 Rev. 1.3 October, 2004 ...