74HC04DR2G ON Semiconductor, 74HC04DR2G Datasheet - Page 2

• Manufacturer Part Number: 74HC04DR2G
• Description: IC HEX INVERTER CMOS 14-SOIC
• Manufacturer: ON Semiconductor
• Series: 74HCr

Specifications of 74HC04DR2G

• Logic Type: Inverter
• Number Of Inputs: 1
• Number Of Circuits: 6
• Current - Output High, Low: 5.2mA, 5.2mA
• Voltage - Supply: 2 V ~ 6 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Logical Function: Inverter
• Logic Family: HC
• Number Of Elements: 6
• High Level Output Current: -5.2mA
• Low Level Output Current: 5.2mA
• Propagation Delay Time: 110ns
• Operating Supply Voltage (typ): 2.5/3.3/5V
• Package Type: SOIC
• Operating Temp Range: -55C to 125C
• Pin Count: 14
• Quiescent Current: 2uA
• Technology: CMOS
• Mounting: Surface Mount
• Operating Temperature Classification: Military
• Operating Supply Voltage (max): 6V
• Operating Supply Voltage (min): 2V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 74HC04DR2GOSTR

Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
*This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be
†Derating − SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
*This package is inherently Pb−Free.
MAXIMUM RATINGS
RECOMMENDED OPERATING CONDITIONS
ORDERING INFORMATION
taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, V
V
(e.g., either GND or V
Specifications Brochure, BRD8011/D.
74HC04DR2G
74HC04DTR2G
Symbol
Symbol
V
out
in
V
V
V
T
t
I
I
V
P
T
, V
T
r
I
out
CC
stg
should be constrained to the range GND v (V
, t
CC
out
CC
in
in
A
D
L
f
out
DC Supply Voltage (Referenced to GND)
DC Input Voltage (Referenced to GND)
DC Output Voltage (Referenced to GND)
DC Input Current, per Pin
DC Output Current, per Pin
DC Supply Current, V
Power Dissipation in Still Air,
Storage Temperature
Lead Temperature, 1 mm from Case for 10 Seconds
DC Supply Voltage (Referenced to GND)
DC Input Voltage, Output Voltage (Referenced to GND)
Operating Temperature, All Package Types
Input Rise and Fall Time
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
(Figure 1)
CC
Device
). Unused outputs must be left open.
CC
and GND Pins
in
or V
Parameter
Parameter
out
http://onsemi.com
) v V
CC
. Unused inputs must always be tied to an appropriate logic voltage level
TSSOP−14*
2
(Pb−Free)
Package
SOIC−14
SOIC or TSSOP Package
TSSOP Package†
SOIC Package†
V
V
V
CC
CC
CC
= 2.0 V
= 4.5 V
= 6.0 V
2500 / Tape & Reel
– 0.5 to V
– 0.5 to V
– 55
Min
2.0
Shipping
– 0.5 to + 7.0
– 65 to + 150
0
0
0
0
Value
±20
±25
±50
500
450
260
CC
CC
†
+ 125
1000
Max
V
+ 0.5
+ 0.5
500
400
6.0
CC
Unit
Unit
mW
mA
mA
mA
_C
_C
_C
ns
V
V
V
V
V
in
and