gsc2596m E-Tech Electronics LTD, gsc2596m Datasheet - Page 3

• Manufacturer Part Number: gsc2596m
• Description: 150 Khz, 2a Pwm Step-down Dc/dc Converter
• Manufacturer: E-Tech Electronics LTD

All Output Voltage Version Electrical Characteristics
Specifications in boldface type are for full operating temperature range. The other type are for T
Feedback bias current
Oscillator frequency
Oscillator frequency of
short circuit protect
Saturation voltage
Max. duty cycle (ON)
Max. duty cycle (OFF)
Current limit
Output leakage current
Quiescent current
ON/OFF pin logic input
Threshold Voltage
ON/OFF pin Logic input
current
ON/OFF pin input
current
Standby quiescent
current
Thermal Resistance
Unless otherwise specified, V
Function Description
The SOP-8 package needs a heat sink under most conditions. The size of the heat sink depends on the input voltage, the output voltage,
the load current and the ambient temperature. The GSC2596M junction temperature rises above ambient temperature with a 2A load and
different input and output voltages. The data for these curves was taken with the GSC2596M operating as a buck-switching regulator in an
ambient temperature of 25 : (still air). These temperature rise numbers are all approximate and there are many factors that can affect
these temperatures. Higher ambient temperatures require more heat sinking.
For the best thermal performance, wide copper traces and generous amounts of printed circuit board copper should be used in the board
layout. (One exception to this is the output (switch) pin, which should not have large areas of copper.) Large areas of copper provide the
best transfer of heat (lower thermal resistance) to the surrounding air, and moving air lowers the thermal resistance even further.
Package thermal resistance and junction temperature rise numbers are all approximate, and there are many factors will affect these
numbers. Some of these factors include board size, shape, thickness, position, location and even board temperature. Other factors are,
trace width, total printed circuit copper area, copper thickness, single or double-sided, multi-layer board and the amount of solder on the
board. The effectiveness of the PC board to dissipate heat also depends on the size, quantity and spacing of other components on the
board, as well as the surrounding air is still or moving. Furthermore, some of these components such as the catch diode will add heat to
the PC board and the heat can vary as the input voltage changes. For the inductor, depending on the physical size, type of core material
and the DC resistance, it could either act as a heat sink taking heat away from the board, or it could add heat to the board.
GSC2596M
Parameter
IN
=12V for 3.3V, 5V, adjustable version and V
Symbol
F
I
F
V
STBY
DC
V
I
I
V
OSC
SCP
I
I
SAT
I
I
FB
CL
JC
JA
Q
H
L
IH
L
IL
V
When current limit occurred and
V
I
V
V
V
Peak current No outside circuit
V
Output=0V
V
Output=-1V, V
V
Low (Regulator ON)
High (Regulator OFF)
V
V
ON/OFF pin=5V, V
Junction to Case
Junction to Ambient with copper
area of approximately 3 in
LOAD
FB
FB
FB
FB
FB
FB
FB
FB
LOGIC
LOGIC
=1.3V
<0.5V, T
=0V force drive on
=0V force drive on
=12V force drive off
=0V force drive on
=12V force drive off
=12V force drive off
=2A No outside circuit
=2.5V ( Regulator OFF)
=0.5V ( Regulator ON)
Conditions
(adjustable version only)
,
No outside circuit
A
=25 : .
IN
=22V
IN
=12V
IN
2
=18V for the 12V version. I
127/110
Min
2.0
5
3
-
-
-
-
-
-
-
-
-
-
-
-
-
J
=25 : .
LOAD
1.25
Typ
-0.1
150
100
150
-10
15
15
70
-5
0
5
-
-
-
-
-
-
=0.5A
ISSUED DATE :2006/03/08
REVISED DATE :2006/05/17B
-50/-100
173/173
1.4/1.5
-0.01
Max
-200
200
0.6
25
10
-1
-
-
-
-
-
-
-
Page: 3/6
Unit
kHz
kHz
: /W
mA
mA
nA
uA
uA
uA
%
V
A
V