mlp2012 TDK Corp., mlp2012 Datasheet - Page 5

• Manufacturer Part Number: mlp2012
• Description: Multilayer Chip Inductors Coils For Dc To Dc Converters
• Manufacturer: TDK Corp.

SMD Inductors(Coils)
For Power Line(Multilayer, Magnetic Shielded)
MLP Series MLP2016
With its internal structure optimized, the MLP2016 type has
achieved DC superimposition characteristics that are comparable
to those of the existing MLP2520 type.
In addition, because low-loss materials are used, the core loss of
the coil can be minimized within a wide frequency range.
MLP2016's choke coils are therefore best suited to several MHz-
drive switching power supplies, the use of which is especially
prominent in mobile devices.
FEATURES
• MLP2016 has DC super imposition characteristics that are com-
• Optimized ferrite materials enable the reduction of losses.
• Magnetically shielded configuration allowing for high-density
• The products contain no lead and also support lead-free
• It is a product conforming to RoHS directive.
APPLICATIONS
Cellular phones, DSCs, DVCs, HDDs, etc.
SPECIFICATIONS
Operating temperature range
Storage temperature range
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
• Please contact our Sales office when your application is considered the following:
• All specifications are subject to change without notice.
250 to 260˚C
230˚C
180˚C
150˚C
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
parable to that of the existing MLP2520 type.
mounting.
soldering.
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
10s max.
–40 to +125°C
[Including self-temperature rise]
–40 to +85°C
Natural
cooling
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L×W
(3) Product characteristics classification code
(4) Inductance value
(5) Management number
(6) Packaging style
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
• After mounting components onto the printed circuit board, do not
• The inductance value may change due to magnetic saturation if
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
MLP 2016 S 2R2 M
(1)
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
apply stress through board bending or mishandling.
the current exceeds the rated maximum.
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
2016
S
2R2
M
T
(2)
(3) (4) (5) (6)
T
Quantity
3000 pieces/reel
Taping [reel]
2.0×1.6mm
STD
2.2µH
t=0.85mm
Conformity to RoHS Directive
001-04 / 20110512 / e533_mlp
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