bcm2046 Broadcom Corp., bcm2046 Datasheet
bcm2046
Manufacturer Part Number
bcm2046
Description
Bcm2046 - Single-chip Bluetooth Edr Hci Solution
Manufacturer
Broadcom Corp.
Datasheet
1.BCM2046.pdf
(2 pages)
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BLUTONIUM
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Voice Codec
Baseband
LPO Clock
Handset
Best-in-class Bluetooth
technology
Built-in output power amplifier supports class 1 transmission
Fully integrated balun and T/R switch eliminates all external
RF matching components
Supports class 1, 2, and 3 designs
Bluetooth 1.1, 1.2, 2.0, and 2.1 standards are fully supported,
including 1-, 2-, and 3-Mbps EDR operation
Lowest current consumption in all modes of operation
ROM-based solution available to eliminate external flash and/
or EEPROM memory
Highest available Bluetooth radio performance of any single-
chip solution
• -90 dBm typical receiver sensitivity using EDR communication
• Programmable output power up to +10 dBm
External BOM requirements of less than 10 external passive
components
Supports high-speed UART baud rate of up to 4 Mbps, USB 2.0
full-speed compliant interface, SDI, and eSPI HCI transports
Fractional-N frequency synthesizer supports any crystal or
TCXO source from 12 MHz to 40 MHz
Automatic calibration and frequency detection of crystal
frequency
Proprietary packet prioritization scheme allowing two
simultaneous A2DP applications
TCXO
Typical Cell Phone Application
XTAL_PD/PU
HOST_WAKE
LPO_INPUT
BT_WAKE
F E A T U R E S
XTAL_IN
UART
PCM
®
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EDR solution in 0.13 μm CMOS
BLUETOOTH
®
BCM2046
Coexistence
®
EDR SINGLE-CHIP HCI SOLUTION
802.11
WLAN
BCM2046
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Host PC
Memory
Brief
Flash
Cellular and mobile communication devices
PDA and low-power embedded communication devices
PC and integration on PC mother board applications
Package types available
• 95-pin fpBGA package (6 mm x 6 mm)
• 65-pin fpBGA package (5 mm x 5 mm)
• Wafer scale flip chip packaging
Maximizes range and simplifies system integration by
providing exceptional output power and receiver sensitivity
High level of integration eliminates challenges of board level
RF design
Achieves smallest board area requirements by minimal
external BOM and smallest package size available today
• Standard PCB requirement is less than 50 mm
• Module solutions less than 25 mm
ROM-based solution with flexible code patching ensures fast
integration
On-chip voltage regulator lowers BOM requirements and
provides additional power savings capability
Minimized power dissipation over other solutions
• 50% power savings in standard telephony headset applications
• 30% power savings in advanced stereo audio applications
S U M M A R Y O F B E N E F I T S
Typical PC Application
A P P L I C A T I O N S
XD[15:0]
XA[18:1]
USB
WE#
OE#
CS#
BCM2046
2
2
Coexistence
802.11
WLAN
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bcm2046 Summary of contents
Page 1
... Wafer scale flip chip packaging Host PC BCM2046 Flash Memory 802.11 Coexistence WLAN Typical PC Application USB CS# BCM2046 WE# OE# XD[15:0] XA[18:1] 2 802.11 Coexistence WLAN ...
Page 2
... BCM2046 for faster communication. The BCM2046 also includes industry collaborative coexistence solutions with WLAN systems. By using Broadcom’s proprietary packet prioritization scheme, the BCM2046 is the industry's first Bluetooth product that is capable of supporting two simultaneous A2DP applications. Cost optimized solutions can be achieved with the BCM2046 by using standard chip-on-board assembly techniques ...