hmc520 Hittite Microwave Corporation, hmc520 Datasheet - Page 4

• Manufacturer Part Number: hmc520
• Description: Gaas Mmic I/q Mixer / Irm Chip, 6 - 10 Ghz
• Manufacturer: Hittite Microwave Corporation

Harmonics of LO
Absolute Maximum Ratings
Outline Drawing
LO = + 15 dBm
Values in dBc below input LO level measured at RF Port.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T=85°C)
(derate 7.8 mW/°C above 85°C)
Thermal Resistance (R
(junction to die bottom)
Storage Temperature
Operating Temperature
LO Freq. (GHz)
10.5
5.5
6.5
8.5
9.5
7.5
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
40
44
52
52
46
47
1
)
nLO Spur at RF Port
48
62
66
59
60
41
2
+20 dBm
+27 dBm
150°C
508 mW
128.2 °C/W
-65 to +150 °C
-55 to +85 deg °C
v01.1007
45
55
58
69
62
51
3
Order On-line at www.hittite.com
54
69
68
55
47
xx
4
MxN Spurious Outputs
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF = 7.6 GHz @ -10 dBm
LO = 7.5 GHz @ +15 dBm
Data taken without IF hybrid
All values in dBc below IF power level
mRF
0
1
2
3
4
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
GP-2
31
90
90
90
xx
0
GaAs MMIC I/Q MIXER
69
90
90
-6
1
0
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. DIE THICKNESS IS .004”
3. TYPICAL BOND PAD IS .004”
4. BACKSIDE METALIZATION: GOLD
5. BOND PAD METALIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. CONNECTION NOT REQUIRED FOR
8. OVERALL DIE SIZE ±.002”
UNLABELED BOND PADS.
nLO
37
72
90
90
47
2
HMC520
Alternate
6 - 10 GHz
21
60
69
79
90
[2]
3
[1]
61
68
90
90
90
4
3 - 69
3