2016L150 LITTELFUSE [Littelfuse], 2016L150 Datasheet - Page 52

• Manufacturer Part Number: 2016L150
• Manufacturer: LITTELFUSE [Littelfuse]

• R ecommendedsolderingmethods:heatelementovenor
• D evicesaredesignedtobewavesolderedtothebottom
• D evicescanbecleanedusingstandardindustrymethods
• T hisprofilecanbeusedforlead-freedevice
Note: I fsolderingtemperaturesexceedtherecommended
• R ecommendedreflowmethods:IR,vaporphaseoven,hot
• D evicesarenotdesignedtobewavesolderedtothe
• D evicescanbecleanedusingstandardindustrymethods
Note: I freflowtemperaturesexceedtherecommended
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Soldering Parameters - Wave Soldering
Condition
Peak Temp/ Duration Time
> 220°C
Preheat 140°C ~ 180°C
Storage Condition
Soldering Parameters - Solder Reflow
Condition
Peak Temp/ Duration Time
> 220°C
Preheat 160°C ~ 190°C
Storage Condition
Physical Specifications
Lead Material
Soldering
Characteristics
Insulating Material
Device Labeling
N
sideoftheboard.
andsolvents.
airoven,N
bottomsideoftheboard.
andsolvents.
2
environmentforlead-free.
profile,devicesmaynotmeettheperformance
requirements.
profile,devicesmaynotmeettheperformance
requirements.
2
environmentforlead-free.
Tin-platedcopper
SolderabilityperMIL-STD-202,
Method208E
Cured,flameretardantepoxypolymer
meetsUL94V-0requirements.
MarkedwithLF,voltage,currentrating,
anddatecode.
WaveSoldering
260°C < 5Sec
2Sec~20Sec
180Sec~210Sec
0°C~35°C < 70%RH
Reflow
260°C > 5Sec
30Sec~60Sec
60Sec~90Sec
0°C~35°C, < 70%RH
POLYFUSE
Radial Leaded
Electronics Designers Guide
®
Resettable PTCs
5
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Environmental Specifications
260
220
190
160
260
220
190
160
0
0
180 to 210
Preheating
Preheating
60 to 90
Soldering
Soldering
30 to 60
2 to 5
Time(s)
Time(s)
Specifications are subject to change without notice.
-40°Cto+85°C
125°C
65°C/85°C,1000hours
+85°C,85%R.H.1000hours
MIL-STD-202FMethod107G
+125°Cto-55°C10times
MIL-STD-202,Method215F
20-30
120
Cooling
Cooling
50R Series