2016L150 LITTELFUSE [Littelfuse], 2016L150 Datasheet - Page 58
![no-image](/images/no-image-200.jpg)
2016L150
Manufacturer Part Number
2016L150
Description
Manufacturer
LITTELFUSE [Littelfuse]
Datasheet
1.2016L150.pdf
(74 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
2016L150DR
Manufacturer:
LITTELFUSE/力特
Quantity:
20 000
- Current page: 58 of 74
- Download datasheet (6Mb)
• R ecommendedreflowmethods:IR,vaporphaseoven,hot
• D evicesarenotdesignedtobewavesolderedtothe
• D evicescanbecleanedusingstandardindustrymethods
Note: I freflowtemperaturesexceedtherecommended
www.littelfuse.com
©2006 Littelfuse
Soldering Parameters - Solder Reflow
Condition
Peak Temp/ Duration Time
> 220°C
Preheat 160°C~ 190°C
Storage Condition
Physical Specifications
Lead Material
Soldering
Characteristics
Insulating Material
Device Labeling
airoven,N
bottomsideoftheboard.
andsolvents.
profile,devicesmaynotmeettheperformance
requirements.
2
environmentforlead-free.
Tin-platedcopper
SolderabilityperMIL-STD-202,
Method208E
Cured,flameretardantepoxypolymer
meetsUL94V-0requirements.
MarkedwithLF,voltage,currentrating,
anddatecode.
Reflow
260°C > 5Sec
30Sec~60Sec
60Sec~90Sec
0°C~35°C, < 70%RH
POLYFUSE
Radial Leaded
Electronics Designers Guide
®
Resettable PTCs
5
Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Environmental Specifications
260
220
190
160
0
Preheating
60 to 90
Soldering
30 to 60
Time(s)
Specifications are subject to change without notice.
-40°Cto+85°C
125°C
85°C/85°C,1000hours
+85°C,85%R.H.1000hours
MIL-STD-202FMethod107G
+125°Cto-55°C10times
MIL-STD-202,Method215F
120
Cooling
00R Series
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