MP1T MITEL [Mitel Networks Corporation], MP1T Datasheet - Page 17

• Manufacturer Part Number: MP1T
• Description: Quadrature Downconverter
• Manufacturer: MITEL [Mitel Networks Corporation]

ADDITIONAL INFORMATION REGARDING THE PSOP PACKAGE.
The following information should be noted when using the PSOP package fitted to the SL1711.
(a)
(b)
(c)
(d)
ABSOLUTE MAXIMUM RATINGS
Characteristics
Supply voltage, Vcc
IFFIN &IFINB input voltage
IFIN & IFINB input DC offset
IOUT & QOUT DC offset
AGC DC offset
VCO1 & 2 DC offset
VCODDIS DC offset
PSCAL & PSCALB DC offset
Storage temperature
Junction temperature
PSOP16 package thermal
resistance, chip to ambient
PSOP16 package thermal
resitance, chip to case
MP16 package thermal resistance
chip to Ambient
MP16 package thermal resistance
chip to case
Power consumption at 5.25V
ESD protection
a thermal adhesive this will enhance the long term reliability of the product by reducing the junction temperature.
The heatsink that is evident on the base of the package is solderable.
There is no direct electrical connection between any of the device pins and the metal heatsinkslug. However if the
heatsink is to be electrically connected to the PCB these connections should be confined to the ground plane.
There is no need to make a thermal connection between the package and the board. If such a connection is made using
This package uses the standard SOIC 16 footprint.
All voltages are reffered to Vee at 0V
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
-0.3
Min
-55
2
Vcc+0.3
Vcc+0.3
Vcc+0.3
Vcc+0.3
Vcc+0.3
Vcc+0.3
Max
TBA
TBA
125
150
657
2.5
81
28
7
Units
Vp-p
mW
C/W
C/W
C/W
C/W
kV
V
V
V
V
V
V
C
C
Mil std 883B method 3015 cat 1
Conditions
SL1711
17