S2083 MA-COM [M/A-COM Technology Solutions, Inc.], S2083 Datasheet
S2083
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S2083 Summary of contents
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Introduction The layout of the surface mount board plays a critical role in product design and must be done properly to achieve the intended performance of an integrated circuit. An accurate PCB pad and solder stencil design provides a proper connection interface between the IC package and the board ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages X1-DFN - 6LD 1.2 x 1.5 mm PDFN - 6LD 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Figure 1-3 PCB Land Designs - cont. 1.5 x 1.2 mm PDFN - 6LD PQFN - 32LD 3 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Table 1. Recommended PCB Land Pattern Dimensions Package Description Package Size Type (mm) X1-DFN PDFN 1.2 x 1.5 PDFN 1.5 x 1.2 PDFN STQFN STQFN 2 x 2.5 PQFN PQFN (1.45 mm Exp. Pad) PQFN (1.7 mm Exp. Pad) ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Solder Mask Considerations The solder mask, a permanent part of most PCB’s applied after etching the metal pads, helps protect the spaces between the metal pads from solder paste and unintended adhesion of solder. ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages 6 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Figure 2-3 Solder Mask Designs - cont. 7 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Figure 2-4 Solder Mask Design - cont. (not shown on right view for clarity) Stencil Design A stencil is used for applying solder paste to the PCB. Although the PCB design suggested in Figures 1 through 2 will help eliminate some ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages 1 mm X1-DFN - 6LD 1.2 x 1.5 mm PDFN - 6LD 2 mm STQFN - 12LD 9 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages 3 mm PQFN 4 mm PQFN 10 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Table 2. Recommended Solder Mask & Stencil Dimensions Package type mm leads X1-DFN PDFN 1.2 x 1.5 PDFN 1.5 x 1.2 PDFN STQFN STQFN 2 x 2.5 PQFN PQFN (1.45 mm Exp. Pad PQFN (1.7 mm Exp. Pad) ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Reflow Profile The most common solder reflow method is accomplished in a belt furnace using convection heat transfer. Tables 3 thru 5 along with Figure 4 show a typical convection reflow profile of temperature versus time. The profile reflects the ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Table 3. Reflow Conditions Profile Feature Preheat/Soak Temperature Min (Ts ) min Temperature Max (Ts ) max Time (t ) from ( min max Ramp-Up Rate (T to Tp) L Liquidous temperature ( Time (t ) maintained above Peak package body temperature (Tp) Time (tp)* within 5 ° ...
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... Application Note S2083 Surface Mount Instructions for QFN / DFN Packages Table 5. Pb-Free Process - Classification Temperature (T Package Thickness <1.6 mm 1.6 mm-2.5 mm >2.5 mm Note 1: At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (T values specified in Tables The use of a higher T Note 2: Package volume excludes external terminals (e ...