S2083 MA-COM [M/A-COM Technology Solutions, Inc.], S2083 Datasheet - Page 13

• Manufacturer Part Number: S2083
• Description: Surface Mount Instructions for QFN / DFN Packages
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

13
Surface Mount Instructions for QFN / DFN Packages
Note 1: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow (e.g., live-bug). If
parts are reflowed in other than the normal live-bug assembly reflow orientation (i.e., dead-bug), T
meet the T
refer to JEP140 for recommended thermocouple use.
Note 2: Reflow profiles in this document are for classification/preconditioning and are not meant to specify board assembly profiles. Actual board assembly
profiles should be developed based on specific process needs and board designs and should not exceed the parameters in Table 3
For example, if T
For a supplier: The peak temperature must be at least 260 °C. The time above 255 °C must be at least 30 seconds.
For a user: The peak temperature must not exceed 260 °C. The time above 255 °C must not exceed 30 seconds.
Note 3: All components in the test load shall meet the classification profile requirements.
Note 4: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,
JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a
higher peak classification temperature is desired.
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Application Note
S2083
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum
Table 4. SnPb Eutectic Process - Classification Temperature (T
Table 3. Reflow Conditions
Classification temperature (T
Peak package body temperature (Tp)
Time (tp)* within 5 °C of the specified
Time 25°C to Peak Temperature
Time (t
Time (t
c
Liquidous temperature (T
requirements, otherwise, the profile shall be adjusted to achieve the latter. To accurately measure actual peak package body temperatures
Temperature Max (Ts
Temperature Min (Ts
Package Thickness
Profile Feature
c
Ramp-Down Rate
s
L
is 260 °C and time t
) from (Ts
) maintained above T
Ramp-Up Rate
Preheat/Soak
<2.5 mm
(T
(Tp to T
≥2.5 mm
profile
L
to Tp)
min
L
)
to Ts
C
min
), see reflow
max
p
is 30 seconds, this means the following for the supplier and the user.
max
)
)
L
)
)
L
For users T
Classification temperature in Table 4
For suppliers T
Classification temperature in Table 4
Sn-Pb Eutectic Assembly
p
Volume mm
must not exceed the
60 - 120 seconds
60 - 150 seconds
3°C/second max.
6°C/second max.
6 minutes max.
p
must not exceed the
20* seconds
100°C
150°C
183°C
235°C
220°C
3
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
<350
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Visit www.macomtech.com for additional data sheets and product information.
p
shall be within ± 2 °C of the live-bug T
For users T
Classification temperature in Table 5
For suppliers T
Classification temperature in Table 5
C
)
Pb-Free Assembly
p
Volume mm
must not exceed the
60 - 120 seconds
60 - 150 seconds
3°C/second max.
6°C/second max.
8 minutes max.
p
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must not exceed the
30* seconds
220°C
220°C
150°C
200°C
217°C
p
and still
3
≥350
Rev. V10