IDT72261 IDT [Integrated Device Technology], IDT72261 Datasheet - Page 3

• Manufacturer Part Number: IDT72261
• Description: CMOS SUPERSYNC FIFOO 16,384 x 9, 32,768 x 9
• Manufacturer: IDT [Integrated Device Technology]

IDT72261/72271 SyncFIFO
16,384 x 9, 32,768 x 9
to the first location in the RAM array. It is synchronized to
RCLK when
sending the same data more than once.
the chip will automatically power down. This occurs if neither
a read nor a write occurs within 10 cycles of the faster clock,
RCLK or WCLK. During the Power Down state, supply current
consumption (I
(by activating control inputs) will immediately take the device
out of the Power Down state.
NOTES
1. DNC = Do not connect.
2. This pin may either be tied to ground or left open.
PIN CONFIGURATIONS (CONT.)
The Retransmit function allows the read pointer to be reset
If, at any time, the FIFO is not actively performing a function,
:
RT
CC2
11
10
09
08
07
06
05
04
03
02
01
is LOW. This feature is convenient for
) is at a minimum. Initiating any operation
GND
DNC
DNC
DNC DNC
DNC
DNC DNC
DNC
A
Q
Q
6
8
DNC
GND
GND
DNC
DNC
V
RT
OE
Q
B
CC
7
RCLK
REN
Q
Q
C
5
4
GND
V
EF
OR
Q
D
CC
Pin 1 Designator
3
/
PGA (G68-1, order code: G)
GND
PAE
V
Q
CC
E
2
TOP VIEW
PAF
HF
Q
Q
F
1
0
of external components is unnecessary. The
functions, together with
total FIFO memory capacity.
is tied to GND if the RCLK frequency is higher than the WCLK
frequency or to Vcc if the RCLK frequency is lower than the
WCLK frequency
submicron CMOS technology.
GND
GND
The IDT72261/72271 are depth expandable. The addition
The FS line ensures optimal data flow through the FIFO. It
The IDT72261/72271 is fabricated using IDT’s high speed
FF
D
IR
G
0
/
DNC
FWFT/
D
D
MILITARY AND COMMERCIAL TEMPERATURE RANGES
SI
1
H
2
MRS
D
D
LD
4
J
3
GND
GND
GND
GND
GND
WCLK
REN
V
SEN
PRS
D
D
CC
5
K
6
(2)
(2)
(2)
(2)
(2)
and
GND
GND
GND
WEN
GND
V
3036 drw 03
D
FS
D
WEN
CC
7
8
(2)
(2)
(2)
(2)
L
, are used to extend the
IR
and
3
OR