MC14049UBCPG ON Semiconductor, MC14049UBCPG Datasheet - Page 5

• Manufacturer Part Number: MC14049UBCPG
• Description: IC INVERTER HEX 1-INPUT 16DIP
• Manufacturer: ON Semiconductor
• Series: 4000Br

Specifications of MC14049UBCPG

• Logic Type: Inverter
• Number Of Inputs: 1
• Number Of Circuits: 6
• Current - Output High, Low: 3.75mA, 24mA
• Voltage - Supply: 3 V ~ 18 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 16-DIP (0.300", 7.62mm)
• Logic Family: MC140
• Number Of Channels Per Chip: Hex
• Polarity: Inverting
• Supply Voltage (max): 18 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• High Level Output Current: - 4.7 mA (Min)
• Input Bias Current (max): 4 uA
• Low Level Output Current: 30 mA (Min)
• Minimum Operating Temperature: - 55 C
• Propagation Delay Time: 120 ns @ 5 V or 65 ns @ 10 V or 50 ns @ 15 V
• Current, Supply: 120 μA
• Function Type: 6-Channels
• Logic Function: Buffer
• Package Type: PDIP-16
• Special Features: Inverting
• Temperature, Operating, Range: -55 to +125 °C
• Voltage, Supply: 3 to 18 VDC
• Number Of Lines (input / Output): 6 / 6
• Logic Device Type: Buffer, Inverting
• Supply Voltage Range: 3V To 18V
• Logic Case Style: DIP
• No. Of Pins: 16
• Operating Temperature Range: -55°C To +125°C
• Filter Terminals: DIP
• Rohs Compliant: Yes
• Family Type: 4000 CMOS
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MC14049UBCPGOS

−T−
16
1
SEATING
PLANE
H
16
1
−A−
G
G
D
0.25 (0.010)
−A−
16 PL
F
D
9
8
16 PL
0.25 (0.010)
M
B
S
T
9
8
K
B
K
C
M
−B−
S
−T−
T
A
A
C
S
P
SEATING
PLANE
PACKAGE DIMENSIONS
M
PLASTIC SOIC PACKAGE
PLASTIC DIP PACKAGE
8 PL
http://onsemi.com
0.25 (0.010)
CASE 751B−05
J
MC14049UB
CASE 648−08
P SUFFIX
D SUFFIX
M
SOIC−16
PDIP−16
ISSUE T
ISSUE J
5
M
L
R
B
X 45
S
_
M
J
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
4. DIMENSION B DOES NOT INCLUDE
5. ROUNDED CORNERS OPTIONAL.
ANSI Y14.5M, 1982.
WHEN FORMED PARALLEL.
MOLD FLASH.
DIM
A
B
C
D
G
H
K
M
F
J
L
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE DAMBAR
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0.020
MIN
0.100 BSC
0.050 BSC
Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
0
DIM
INCHES
A
B
C
D
G
K
M
P
R
F
J
_
0.770
0.270
0.175
0.021
0.015
0.130
0.305
0.040
MAX
MILLIMETERS
MIN
0.70
9.80
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
10
1.27 BSC
0
_
_
10.00
18.80
MAX
MILLIMETERS
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
MIN
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0.51
7
2.54 BSC
1.27 BSC
0
_
_
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0.229
0.010
MIN
19.55
MAX
0.050 BSC
6.85
4.44
0.53
1.77
0.38
3.30
7.74
1.01
0
INCHES
10
_
_
0.393
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_