cspemi205 California Micro Devices Corporation, cspemi205 Datasheet - Page 6

• Manufacturer Part Number: cspemi205
• Description: 3 Channel Headset Emi Filter With Esd Protection
• Manufacturer: California Micro Devices Corporation

Application Information
Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages
offered by California Micro Devices.
© 2008 California Micro Devices Corp. All rights reserved.
6
PARAMETER
Pad Size on PCB
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance — Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature
490 N. McCarthy Blvd., Milpitas, CA 95035-5112
Figure 4. Recommended Non-Solder Mask Defined Pad Illustration
PRINTED CIRCUIT BOARD RECOMMENDATIONS
Non-Solder Mask Defined Pad
250
200
150
100
50
0
Solder Stencil Opening
Figure 5. Lead-free (SnAgCu) Solder
Solder Mask Opening
1:00.0
0.275mm DIA.
0.330mm DIA.
0.325mm DIA.
Ball Reflow Profile
●
Issue B – 04/30/08
Time (minutes)
2:00.0
Tel: [phone]
3:00.0
●
4:00.0
Fax: [phone]
Non-Solder Mask defined pads
OSP (Entek Cu Plus 106A)
0.125 - 0.150mm
0.275mm Round
0.325mm Round
0.330mm Round
50/50 by volume
60 seconds
●
No Clean
VALUE
+50μm
+20μm
260°C
CSPEMI205
www.cmd.com