la73b-1-2g.yg-s2-pf Ligitek Electronics Co., Ltd., la73b-1-2g.yg-s2-pf Datasheet

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... LED ARRAY DOC QW0905-LA73B-1/2G.YG-S2-PF REV. DATE LIGITEK ELECTRONICS CO.,LTD. LA73B-1/2G.YG-S2-PF DATA SHEET : -Jul. - 2008 Property of Ligitek Only Lead-Free Parts Pb ...

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... PART NO. LA73B-1/2G.YG-S2-PF Package Dimensions 5.08 2.5 □ 0.5 Y TYP LG2640-1-PF 1.5MAX □ 0.5 TYP 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. 4.4 G 2.9 G 1.5 YG 3.5 ± 0.5 4.65 ± 0.5 2.54TYP + - 2 1 LYG2662-PF 2.9 3.1 3.3 4.3 25.0MIN □ 0.5 TYP 1 ...

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... PART NO. LA73B-1/2G.YG-S2-PF Absolute Maximum Ratings at Ta=25 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 MATERIAL PART NO GaP GaAsP/GaP LA73B-1/2G.YG-S2-PF GaP Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. ...

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... PART NO. LA73B-1/2G.YG-S2-PF Typical Electro-Optical Characteristics Curve G CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 3.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 3 ...

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... PART NO. LA73B-1/2G.YG-S2-PF Typical Electro-Optical Characteristics Curve Y CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 3.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 500 550 600 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 3 ...

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... PART NO. LA73B-1/2G.YG-S2-PF Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 °C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5°C/sec(max) Solder Bath:260° ...

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... PART NO. LA73B-1/2G.YG-S2-PF Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95% High Humidity Test 3.t=240hrs 1.Ta=105 ...

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PACKING SPECIFICATION 1.200 PCS / BAG 2. 8 BAG / INNER BOX SIZE : 33.5cm X 19cm X 7.5cm INNER BOXES / CARTON SIZE : 58.5cm ...