la73b-1-hxx-pf Ligitek Electronics Co., Ltd., la73b-1-hxx-pf Datasheet

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la73b-1-hxx-pf

Manufacturer Part Number
la73b-1-hxx-pf
Description
Led Array
Manufacturer
Ligitek Electronics Co., Ltd.
Datasheet
LED ARRAY
DOC. NO :
REV.
DATE
DATA SHEET
LA73B-1/HXX-PF
:
:
QW0905-L
A
19 - Jun.
LIGITEK ELECTRONICS CO.,LTD.
- 2009
A73B-1/HXX-PF
Property of Ligitek Only
Lead-Free Parts
Pb
立碁電子
發行
DCC

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la73b-1-hxx-pf Summary of contents

Page 1

... LED ARRAY DOC REV. DATE LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only LA73B-1/HXX-PF DATA SHEET QW0905-L A73B-1/HXX- Jun. - 2009 Pb Lead-Free Parts 發行 立碁電子 DCC ...

Page 2

... PART NO. LA73B-1/HXX-PF Package Dimensions ψ 2.9X3 5.08 2.5 □ 0.5 TYP LH2640-1-PF Note : 1.All dimension are in millimeter tolerance is ± 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only 2.4±0.5 4.4 2 1.5 X 4.0±0.5 2.54±0. 2.9 3.3 1.5MAX □ 0.5 TYP 2.54TYP ...

Page 3

... PART NO. LA73B-1/HXX-PF Absolute Maximum Ratings at Ta=25 Parameter Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Typical Electrical & Optical Characteristics (Ta=25 PART NO MATERIAL GaP LA73B-1/HXX-PF Note : 1.The forward voltage data did not including ± 0.1V testing tolerance. ...

Page 4

... PART NO. LA73B-1/HXX-PF Typical Electro-Optical Characteristics Curve H CHIP Fig.1 Forward current vs. Forward Voltage 1000 100 10 1.0 0.1 1.0 2.0 3.0 Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature 1.2 1.1 1.0 0.9 0.8 -40 - Ambient Temperature( ℃ ) Fig.5 Relative Intensity vs. Wavelength 1.0 0.5 0.0 600 700 800 Wavelength (nm) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Fig.2 Relative Intensity vs. Forward Current 3 ...

Page 5

... LA73B-1/HXX-PF PART NO. Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 ° C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to case) 2.Wave Soldering Profile Dip Soldering Preheat: 120° C Max Preheat time: 60seconds Max Ramp-up 2°C/sec(max) Ramp-Down:-5° ...

Page 6

... PART NO. LA73B-1/HXX-PF Reliability Test: Test Item 1.Under Room Temperature Operating Life Test 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature 1.Ta=105 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) Low Temperature 1.Ta=-40 Storage Test 2.t=1000 hrs (-24hrs, +72hrs) 1.Ta=65 High Temperature 2.RH=90 %~95% High Humidity Test 3.t=240hrs 1 ...

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