cxp86460 Sony Electronics, cxp86460 Datasheet - Page 25

• Manufacturer Part Number: cxp86460
• Description: Cmos 8-bit Single Chip Microcomputer
• Manufacturer: Sony Electronics

Package Outline
Unit: mm
LEAD PLATING SPECIFICATIONS
LEAD MATERIAL
SOLDER COMPOSITION
PLATING THICKNESS
SONY CODE
EIAJ CODE
JEDEC CODE
SONY CODE
EIAJ CODE
JEDEC CODE
49
64
49
64
0.5
0.5
ITEM
1
1
48
48
∗
∗
0.1 ± 0.1
0.1 ± 0.1
0˚ to 10˚
0˚ to 10˚
12.0 ± 0.2
10.0 ± 0.1
12.0 ± 0.2
10.0 ± 0.1
DETAIL A
DETAIL A
LQFP-64P-L01
P-LQFP64-10x10-0.5
LQFP-64P-L01
P-LQFP64-10x10-0.5
b
b
42 ALLOY
Sn-Bi Bi:1-4wt%
5-18μm
33
33
16
16
64PIN LQFP (PLASTIC)
64PIN LQFP (PLASTIC)
SPEC.
32
17
32
17
(0.22)
(0.22)
0.13 M
0.13 M
NOTE: Dimension “∗” does not include mold protrusion.
NOTE: Dimension “∗” does not include mold protrusion.
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PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
PACKAGE STRUCTURE
PACKAGE STRUCTURE
DETAIL B: SOLDER
DETAIL B: SOLDER
b = 0.18 – 0.03
b = 0.18 – 0.03
1.5 – 0.1
1.5 – 0.1
( 0.18 )
( 0.18 )
CXP86212/86216, CXP86324/86332, CXP86440/86448/86460
+ 0.2
+ 0.2
+ 0.08
+ 0.08
A
A
EPOXY RESIN
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
0.3g
SOLDER PLATING
42/COPPER ALLOY
0.3g
0.1
0.1
Sony Corporation