nup2301 ON Semiconductor, nup2301 Datasheet
nup2301
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nup2301 Summary of contents
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... NUP2301MW6T1 Low Capacitance Diode Array for ESD Protection in Two Data Lines NUP2301MW6T1 is a MicroIntegration device designed to provide protection for sensitive components from possible harmful electrical transients; for example, ESD (electrostatic discharge). Features • Low Capacitance (2.0 pf Maximum Between I/O Lines) • Single Package Integration Design • ...
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THERMAL CHARACTERISTICS Characteristic Thermal Resistance Junction−to−Ambient Lead Solder Temperature Maximum 10 Seconds Duration Junction Temperature Storage Temperature ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Reverse Breakdown Voltage (I = 100 mA) (BR) Reverse Voltage Leakage Current Capacitance (between I/O pins) Capacitance (between ...
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... 0.0197 0.40 0.0157 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SC−88/SC70−6/SOT−363 CASE 419B−02 ISSUE 02U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14 ...
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... USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative. NUP2301MW6T1/D ...