UPD70433GD-16-5BB NEC [NEC], UPD70433GD-16-5BB Datasheet - Page 162

• Manufacturer Part Number: UPD70433GD-16-5BB
• Description: V55PITM 16-BIT MICROPROCESSOR
• Manufacturer: NEC [NEC]

162
21. RECOMMENDED SOLDERING CONDITIONS
Technology Manual” (C10535E).
(1)
*
Note
(2)
Note
Note
This product should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document “Semiconductor Device Mounting
For soldering methods and conditions other than those recommended, contact our sales personnel.
For the storage period after dry-pack decompression, storage conditions are max. 25 C, 65 % RH.
PD70433R-xx : 132-Pin Ceramic PGA
PD70433GD-xx-5BB : 120-Pin Plastic QFP (28
PD70433GJ-xx-3EB : 120-Pin Plastic QFP (Fine Pitch) (20
Soldering Method
Soldering Method
Soldering Method
Wave soldering
Wave soldering
(lead part only)
Infrared reflow
Partial heating
Infrared reflow
Partial heating
Partial heating
Use of more than one soldering method should be avoided (except in the case of partial heating method).
Use of more than one soldering method should be avoided (except in the case of partial heating method).
Wave soldering is used on the lead part only, and care must be taken to prevent solder from coming into
direct contact with the body.
VPS
VPS
Package peak temperature: 235 C, Duration: 30 sec. max. (at 210 C
or above), Number of times: Within twice, Time limit: 7 days*
(thereafter 36 hours 125 C prebanking required)
Package peak temperature: 215 C, Duration: 40 sec. max. (at 200 C
or above), Number of times: Within twice, Time limit: 7 days*
(thereafter 36 hours 125 C prebanking required)
Solder bath temperature: 260 C or less, Time: 10 sec. max.,
Number of times: Once, Time limit: 7 days* (thereafter 35 hours
125 C prebanking required), Preheating temperature: 120 C max.
(Package surface temperature)
Pin temperature: 300 C or below, Duration: 3 sec. max. (per pin row)
Package peak temperature: 235 C, Duration: 30 sec. max. (at 210 C
or above), Number of times: Within twice
Package peak temperature: 215 C, Duration: 40 sec. max. (at 200 C
or above), Number of times: Within twice
Pin temperature: 300 C or below, Duration: 3 sec. max. (per pin row)
Solder temperature: 260 C or less, Duration: 10 sec. max.
Pin temperature: 300 C or less, Duration: 3 sec. max. (per pin row)
Table 21-1. Surface Mount Type Soldering Conditions
Table 21-2. Insertion Type Soldering Conditions
Soldering Conditions
Soldering Conditions
Soldering Conditions
28 mm)
20 mm)
Condition Symbol
Condition Symbol
Recommended
Recommended
WS60-367-1
VP15-367-2
IR35-367-2
VP15-00-2
IR35-00-2
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PD70433