ssd1800 ETC-unknow, ssd1800 Datasheet - Page 7

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ssd1800

Manufacturer Part Number
ssd1800
Description
80x16 + 1 Icon Line Lcd Segment / Common Driver With Controller For Character Display System
Manufacturer
ETC-unknow
Datasheet
5
Alignment Keys
Die Size:
Die Thickness:
PAD: 1-63
PAD: 65-79,
PAD: 81-162
PAD: 64,80,163,179
Bump Height: Nominal
Note:
1. PADS: 35-36, 45, 64-65, 75-81, 162-164, 166-169, 178-179 NC pads.
2. The die faces up in the diagram.
3. Coordinates are reference to the center of the chip.
4. Unit of coordinates and size of all alignment keys are in um.
5. All alignment keys do not contain gold bump.
SSD1800 Series
26.3 µm 26.3 µm 26.3 µm
Center (-2940.9, 480.0)
PIN ARRANGEMENT OF SSD1800Z GOLD BUMP DIE
X
(-2835, -598.5)
8.75µm
Rev 1.0
X
37.6µm
6170um x 1480um (include scribe line)
6070um x 1380um (exclude scribe line)
670 +/-25um
Bump Size
52.15 x 60.2 um
164-178 74.9 x 42 um
42 x 74.9 um
52.15 X 52.15 um
18um
P 7/42
Figure 2 - SSD1800Z Pin Arrangement
Mar 2004
26.3 µm 26.3 µm 26.3 µm
Center (2940.9, 480.0)
X
Minimum Pitch
76.3um
63.7um
63.7um
(2835, -598.5)
8.75µm
X
37.6µm
Center (-2101.9, 169.6)
61.3µm
Solomon Systech
X

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