T810-400B STMICROELECTRONICS [STMicroelectronics], T810-400B Datasheet

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T810-400B

Manufacturer Part Number
T810-400B
Description
HIGH PERFORMANCE TRIACS
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet

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FEATURES
I
SENSITIVE GATE : I
HIGH COMMUTATION TECHNOLOGY
HIGH I
DESCRIPTION
The T810-xxxB and T835-xxxB series are using
high performance TOPGLASS PNPN technology.
These devices are intented for AC control applica-
tions, using surface mount technology where high
commutating and surge performances are re-
quired (like power tools, Solid State Relay).
ABSOLUTE MAXIMUM RATINGS
May 1998 Ed : 1A
TRMS
Symbol
Symbol
I
V
V
T(RMS)
I
dI/dt
Tstg
TSM
DRM
RRM
I
Tj
T
2
= 8 A
TSM
t
CAPABILITY
®
Repetitive peak off-state voltage
Tj = 125 C
RMS on-state current
(360 conduction angle)
Non repetitive surge peak on-state current
( Tj initial = 25 C )
I
Critical rate of rise of on-state current
I
Storage temperature range
Operating junction temperature range
Maximum temperature for soldering during 10 s
2
G
t value for fusing
= 50mA di
GT
10mA and 35mA
G
/dt = 0.1A/ s
Parameter
Parameter
HIGH PERFORMANCE TRIACS
Tc =110 C
tp = 8.3 ms
tp = 10 ms
tp = 10 ms
Repetitive
Repetitive
F = 50 Hz
Non
A2
(Plastic)
400B
DPAK
400
- 40 to + 150
- 40 to + 125
T810-/T835-
A1
Value
T810-xxxB
T835-xxxB
100
260
85
80
32
20
A2
8
600B
600
G
1/5
A/ s
Unit
Unit
A
V
A
A
C
C
C
2
s

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T810-400B Summary of contents

Page 1

... HIGH COMMUTATION TECHNOLOGY HIGH I CAPABILITY TSM DESCRIPTION The T810-xxxB and T835-xxxB series are using high performance TOPGLASS PNPN technology. These devices are intented for AC control applica- tions, using surface mount technology where high commutating and surge performances are re- quired (like power tools, Solid State Relay). ...

Page 2

... T810-xxxB / T835-xxxB THERMAL RESISTANCES Symbol Rth (j-c) Junction to case for DC Rth (j-c) Junction to case for AC 360 conduction angle ( F= 50 Hz) Rth (j-a) Junction to ambient (S = 0.5 cm GATE CHARACTERISTICS (maximum values ( G(AV) GM ELECTRICAL CHARACTERISTICS Symbol Test Conditions I V =12V (DC =12V (DC) R ...

Page 3

... Fig 1a: Maximum power dissipation versus RMS on-state current (T810 only). P( (A) T(RMS Fig 2: Correlation between maximum power dissi- pation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink+contact. P(W) 10 Rth=5°C/W Rth=10 °C Rth=15 °C/W ...

Page 4

... T810-xxxB / T835-xxxB Fig 6: Non repetitive surge peak on-state current versus number of cycles. I (A) TSM Number of cycles Fig 8: On-state characteristics (maximum values). I (A) TM 100.0 Tj=Tj max. 10.0 Tj=25°C 1.0 V (V) TM 0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 4/5 Fig 7: Non repetitive surge peak on-state current for a sinusoidal pulse with width tp<10ms, and cor- ...

Page 5

... Min. Typ. Max Min. Typ. Max. 2.20 2.40 0.086 0.90 1.10 0.035 0.03 0.23 0.001 0.64 0.90 0.025 5.20 5.40 0.204 0.45 0.60 0.017 0.48 0.60 0.018 6.00 6.20 0.236 6.40 6.60 0.251 4.40 4.60 0.173 9.35 10.10 0.368 0.80 0.031 0.60 1.00 0.023 0° 8° 0° TYPE MARKING T8 T810-400B 1040 T8 T810-600B 1060 T8 T835-400B 3540 T8 T835-600B 3560 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397 0.039 8° 5/5 ...

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