AD5821-WAFER AD [Analog Devices], AD5821-WAFER Datasheet - Page 15

• Manufacturer Part Number: AD5821-WAFER
• Description: 120 mA, Current Sinking, 10-Bit, I2C DAC
• Manufacturer: AD [Analog Devices]

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
AD5821BCBZ-REEL7
AD5821BCBZ-REEL
AD5821-WAFER
AD5821D-WAFER
EVAL-AD5821EBZ
1
Z = Pb-free part.
IDENTIFIER
1
1
BALL 1
1
−40°C to +85°C
−40°C to +85°C
Temperature Range
−40°C to +85°C
−40°C to +85°C
(BALL SIDE DOWN)
TOP VIEW
1.575
1.515
1.455
Figure 27. 9-Ball Wafer Level Chip Scale Package [WLCSP]
Package Description
9-Ball Wafer Level Chip Scale Package (WLCSP)
9-Ball Wafer Level Chip Scale Package (WLCSP)
Bare Die Wafer
Bare Die Wafer on Film
Evaluation Board
1.750
1.690
1.630
Dimensions shown in millimeters
0.28
0.24
0.20
Rev. 0 | Page 15 of 16
(CB-9-1)
0.65
0.59
0.53
0.50 BSC
BALL PITCH
SEATING
PLANE
0.36
0.32
0.28
3
BOTTOM VIEW
(BALL SIDE UP)
2
Package Option
CB-9-1
CB-9-1
1
B
C
A
Branding
D82
D82
AD5821