NBB-400-D RFMD [RF Micro Devices], NBB-400-D Datasheet - Page 5
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NBB-400-D
Manufacturer Part Number
NBB-400-D
Description
CASCADABLE BROADBAND GaAs MMIC AMPLIFIER DC TO 8GHz
Manufacturer
RFMD [RF Micro Devices]
Datasheet
1.NBB-400-D.pdf
(10 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NBB-400-D
Manufacturer:
RFMD
Quantity:
5 000
Company:
Part Number:
NBB-400-D-SB
Manufacturer:
RFMD
Quantity:
5 000
Die Sales Information
Die Packaging
Package Storage
Die Handling
Rev A8 060124
• All segmented die are sold 100% DC-tested. Testing parameters for wafer-level sales of die material shall be nego-
• Segmented die are selected for customer shipment in accordance with RFMD Document #6000152 - Die Product
• Segmented die has a minimum sales volume of 100 pieces per order. A maximum of 400 die per carrier is allow-
• All die are packaged in GelPak ESD protective containers with the following specification:
• GelPak ESD protective containers are placed in a static shield bag. RFMD recommends that once the bag is
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit
• Unit packages should be kept in a dry nitrogen environment for optimal assembly, performance, and reliability.
• Precaution must be taken to minimize vibration of packaging during handling, as die can shift during transit
• Proper ESD precautions must be taken when handling die material.
• Die should be handled using vacuum pick-up equipment, or handled along the long side with a sharp pair of twee-
• When using automated pick-up and placement equipment, ensure that force impact is set correctly. Excessive force
tiated on a case-by-case basis.
Final Visual Inspection Criteria
able.
O.D.=2"X2", Capacity=400 Die (20X20 segments), Retention Level=High(X0).
opened the GelPak/s should be stored in a controlled nitrogen environment. Do not press on the cover of a closed
GelPak, handle by the edges only. Do not vacuum seal bags containing GelPak containers.
zers. Do not touch die with any part of the body.
may damage GaAs devices.
Chip Outline Drawing - NBB-400-D
UNITS:
Sales Criteria - Unpackaged Die
Inches
(mm)
1
OUTPUT
.
Chip Dimensions: 0.017” x 0.017” x 0.004”
0.017 ± 0.001
(0.44 ± 0.03)
GND
VIA
INPUT
0.017 ± 0.001
(0.44 ± 0.03)
0.004 ± 0.001
Back of chip is ground.
(0.10 ± 0.03)
NBB-400
2
2
.
.
4-37