UPC8001 NEC, UPC8001 Datasheet - Page 20

• Manufacturer Part Number: UPC8001
• Description: IF AMPLIFIER IC WITH ON-CHIP MIXER FOR DIGITAL CELLULAR PHONES
• Manufacturer: NEC

7. RECOMMENDED SOLDERING CONDITIONS
refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL” (IEI-1207).
done under different conditions.
Types of Surface Mount Device
20
PC8001GR: 14-pin plastic shrink SOP (225 mil)
Infrared ray reflow
Partial heating
method
Soldedering process
The following conditions must be met for soldering conditions of the
Please consolt with our sales offices in case other soldering process is used, or in case the soldering is
Peak temperature of package surface: 235 ˚C or below,
Reflow time: 30 seconds or below (210 ˚C or higher),
Number of reflow processes: MAX. 2
[Remark]
(1) Please start the second reflow process after the temperature,
(2) Please avoid removing the residual flux with water after the
Terminal temperature: 300 ˚C or below,
Time: 3 seconds or below (Per one side of the device).
raised by the first reflow process, returns to normal.
first reflow process.
Soldering conditions
PC8001. For more details,
IR35-107-2
Symbol
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PC8001