UPC8106 NEC, UPC8106 Datasheet - Page 21

• Manufacturer Part Number: UPC8106
• Description: SILICON MMIC 2.0 GHz FREQUENCY UP-CONVERTER FOR CELLULAR/CORDLESS TELEPHONES
• Manufacturer: NEC

NOTES ON CORRECT USE
(1)
(2)
(3)
(4)
(5)
RECOMMENDED SOLDERING CONDITIONS
conditions other than those recommended below, contact your NEC sales representative.
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
Infrared Reflow
VPS
Wave Soldering
Partial Heating
Soldering Method
This product should be soldered under the following recommended conditions.
Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document
Observe precutions for handling because of electrostatic sensitive devices.
Form a ground pattern wide as possible to minimize ground impedance (to prevent undesired oscillation).
Keep the wiring length of the ground pins as short as possible.
Connect a bypass capacitor to the V
Connect a matching circuit to the RF output pin.
Package peak temperature: 235°C or below
Time: 30 seconds or less (at 210°C)
Count: 3, Exposure limit: None
Package peak temperature: 215°C or below
Time: 40 seconds or less (at 200°C)
Count: 3, Exposure limit: None
Soldering bath temperature: 260°C or below
Time: 10 seconds or less
Count: 1, Exposure limit: None
Pin temperature: 300°C
Time: 3 seconds or less (per side of device)
Exposure limit: None
CC
Note
pin.
Data Sheet P12770EJ2V0DS00
Soldering Conditions
Note
Note
Note
PC8106TB, PC8109TB
For soldering methods and
Recommended Condition
Symbol
WS60-00-1
VP15-00-3
IR35-00-3
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