CY7C1302DV25_11 CYPRESS [Cypress Semiconductor], CY7C1302DV25_11 Datasheet
CY7C1302DV25_11
Related parts for CY7C1302DV25_11
CY7C1302DV25_11 Summary of contents
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Burst of Two Pipelined SRAMs with QDR™ Architecture Features Separate independent Read and Write data ports ■ Supports concurrent transactions ❐ 167-MHz clock for high bandwidth ■ 2.5 ns Clock-to-Valid access time ❐ 2-word burst on all accesses ■ ...
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Logic Block Diagram - CY7C1302DV25 D [17:0] 18 Address A Register (17: CLK K Gen. Vref Control WPS Logic BWS 0 BWS 1 Document Number: 38-05625 Rev. *D Write Write Data Reg Data Reg Address Register 256Kx18 256Kx18 ...
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Contents Selection Guide ................................................................ 4 Pin Configuration ............................................................. 4 165-ball FBGA (13 × 15 × 1.4 mm) Pinout .................. 4 Pin Definitions .................................................................. 4 Introduction ....................................................................... 5 Functional Overview .................................................... 5 Read Operations ......................................................... 6 Write Operations ......................................................... 6 Byte ...
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Selection Guide Maximum Operating Frequency Maximum Operating Current Pin Configuration Gnd/144M NC/36M D10 D NC D11 Q10 Q11 F NC Q12 D12 G NC D13 ...
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Pin Definitions (continued) Name I/O RPS Input- Read Port Select, active LOW. Sampled on the rising edge of positive input clock (K). When Synchronous active, a Read operation is initiated. Deasserting will cause the Read port to be deselected. When ...
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Read Operations The CY7C1302DV25 is organized internally as 2 arrays of 256 K × 18. Accesses are completed in a burst of two sequential 18-bit data words. Read operations are initiated by asserting RPS active at the rising edge of ...
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Application Example [1] Note 1. The above application shows 4 QDR-I being used. Document Number: 38-05625 Rev. *D CY7C1302DV25 Page [+] Feedback ...
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Truth Table [ Operation Write Cycle: Load address on the rising edge of K clock; input write data on K and K rising edges. Read Cycle: Load address on the rising edge of K clock; ...
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IEEE 1149.1 Serial Boundary Scan (JTAG) These SRAMs incorporate a serial boundary scan test access port (TAP) in the FBGA package. This part is fully compliant with IEEE Standard #1149.1-1900. The TAP operates using JEDEC standard 2.5 V I/O logic ...
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IDCODE The IDCODE instruction causes a vendor-specific, 32-bit code to be loaded into the instruction register. It also places the instruction register between the TDI and TDO pins and allows the IDCODE to be shifted out of the device when ...
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TAP Controller State Diagram TEST-LOGIC 1 RESET 0 1 TEST-LOGIC/ 0 IDLE Note 9. The 0/1 next to each state represents the value at TMS at the rising edge of TCK. Document Number: 38-05625 Rev. *D [9] 1 SELECT DR-SCAN ...
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TAP Controller Block Diagram Selection TDI Circuitry TCK TMS TAP Electrical Characteristics [10, 11, 12] Over the Operating Range Parameter Description V Output HIGH Voltage OH1 V Output HIGH Voltage OH2 V Output LOW Voltage OL1 V Output LOW Voltage ...
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TAP AC Switching Characteristics [13, 14] Over the Operating Range Parameter t TCK Clock Cycle Time TCYC t TCK Clock Frequency TF t TCK Clock HIGH TH t TCK Clock LOW TL Set-up Times t TMS Set-up to TCK Clock ...
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TAP Timing and Test Conditions 1. TDO = 50 (a) GND Test Clock TCK Test Mode Select TMS Test Data-In TDI Test Data-Out TDO Identification Register Definitions Instruction Field ...
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Scan Register Sizes Register Name Instruction Bypass ID Boundary Scan Instruction Codes Instruction Code EXTEST 000 Captures the Input/Output ring contents. IDCODE 001 Loads the ID register with the vendor ID code and places the register between TDI and TDO. ...
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Boundary Scan Order Bit # Bump ID Bit # 11P 36 10 ...
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Maximum Ratings Exceeding maximum ratings may shorten the useful life of the device. User guidelines are not tested. Storage Temperature .............................. –65 ° 150 °C Ambient Temperature with Power Applied ........................................ –55 ° 125 °C Supply ...
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Thermal Resistance [23] Parameter Description Thermal Resistance JA (Junction to Ambient) Thermal Resistance JC (Junction to Case) Capacitance [23] Parameter Description C Input Capacitance IN C Clock Input Capacitance CLK C Output Capacitance O AC Test Loads and ...
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Switching Characteristics (continued) [24] Over the Operating Range Cypress Consortium Parameter Parameter Hold Times t t Address Hold after Clock (K and K) Rise Control Signals Hold after Clock (K and K) Rise HC HC (RPS, ...
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Switching Waveforms [28, 29, 30] READ WRITE READ RPS tSC tHC WPS D10 D11 D30 ...
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Ordering Information Cypress offers other versions of this type of product in many different configurations and features. The below table contains only the list of parts that are currently available. For a complete listing of all options, visit the Cypress ...
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Package Diagram Document Number: 38-05625 Rev. *D CY7C1302DV25 51-85180 *C Page [+] Feedback ...
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Acronyms Acronym Description BWS byte write select DDR double data rate FBGA fine-pitch ball grid array HSTL high-speed transceiver logic I/O Input/output JTAG joint test action group LSB least significant bit MSB most significant bit NC no connect QDR quad ...
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Document History Page Document Title: CY7C1302DV25, 9-Mbit Burst of Two Pipelined SRAMs with QDR™ Architecture Document Number: 38-05625 Submission Orig. of REV. ECN NO. Date Change ** 253010 See ECN *A 436864 See ECN *B 2896202 03/19/2010 *C 3122015 12/28/2010 ...
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Sales, Solutions, and Legal Information Worldwide Sales and Design Support Cypress maintains a worldwide network of offices, solution centers, manufacturer’s representatives, and distributors. To find the office closest to you, visit us at Cypress Locations. Products Automotive cypress.com/go/automotive Clocks & ...