VSC8116QP VITESSE [Vitesse Semiconductor Corporation], VSC8116QP Datasheet - Page 16

• Manufacturer Part Number: VSC8116QP
• Description: ATM/SONET/SDH 622/155Mb/s Transceiver Mux/Demux with Integrated Clock Generation
• Manufacturer: VITESSE [Vitesse Semiconductor Corporation]

ATM/SONET/SDH 622/155Mb/s Transceiver
Mux/Demux with Integrated Clock Generation
Page 16
Package Thermal Characteristics
to the industry-standard EIAJ footprint for a 10x10mm body but has been enhanced to improve thermal dissipa-
tion with the inclusion of an exposed Copper Heat Spreader. The package construction is as shown in Figure
10.
the die to the exposed surface of the heat spreader and from the die to the lead frame through the heat spreader
overlap of the lead frame.
Table 13: 64-Pin PQFP Thermal Resistance
guarantee that the maximum case temperature specification is not violated. Given the thermal resistance of the
package in still air, the user can operate the VSC8116 in still air if the ambient temperature does not exceed
71
priate heatsink must be used with the part or adequate airflow must be provided.
o
C (71
The VSC8116 is packaged into a thermally-enhanced plastic quad flatpack (PQFP). This package adheres
The thermal resistance for the VSC8116 package is improved through low thermal resistance paths from
The VSC8116QB1 is designed to operate at a maximum case temperature of up to 115
Symbol
ca-100
ca-200
ca-400
ca-600
ca
jc
o
C = 115
Insulator
Thermal resistance from junction to case
Thermal resistance from case to ambient in still air including conduction through
the leads for a non-thermally saturated board.
Thermal resistance from case to ambient in 100 LPFM air
Thermal resistance from case to ambient in 200 LPFM air
Thermal resistance from case to ambient in 400 LPFM air
Thermal resistance from case to ambient in 600 LPFM air
o
C - 1.2W * 37
Wire Bond
Copper Heat Spreader
741 Calle Plano, Camarillo, CA 93012 • 805/388-3700 • FAX: [phone]
o
VITESSE
C/W). If operation above this ambient temperature is required, then an appro-
VITESSE SEMICONDUCTOR CORPORATION
SEMICONDUCTOR CORPORATION
Figure 10: Package Cross Section
Description
Die
Plastic Molding Compound
Lead
Value
o
2.5
37
31
28
24
22
C. The user must
VSC8116
Data Sheet
G52220-0, Rev 4.1
Units
o
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
C/W
1/8/00