HSP48410/883 INTERSIL [Intersil Corporation], HSP48410/883 Datasheet - Page 4

• Manufacturer Part Number: HSP48410/883
• Description: Histogrammer/Accumulating Buffer
• Manufacturer: INTERSIL [Intersil Corporation]

Absolute Maximum Ratings
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+8V
Input, Output Voltage . . . . . . . . . . . . . . . . .GND -0.5V to V
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Voltage Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -55
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
Device Guaranteed and 100% Tested
NOTES:
Logical One Input Voltage
Logical Zero Input Voltage
High Level Clock Input
Low Level Clock Input
Output High Voltage
Output Low Voltage
Input Leakage Current
I/O Leakage Current
Standby Supply Current
Operating Power Supply Cur-
rent
Functional Test
1. θ
2. Interchanging of force and sense conditions is permitted.
3. Power supply current is proportional to operating frequency. Typical rating for I
4. Tested as follows: f = 1MHz, V
5. Loading is as specified in the test load circuit with C
considered when operating part at high clock frequencies.
JA
PARAMETER
is measured with the component mounted on an evaluation PC board in free air.
SYMBOL
4
I
I
IH
V
CCSB
CCOP
V
V
V
V
V
FT
I
IHC
ILC
OH
I
OL
O
IH
L
IL
= 2.6V, V
V
V
V
V
I
V
I
V
V
V
V
V
V
V
Outputs Open
f = 25.6MHz,
V
V
(Notes 4, 5)
OH
OL
IL
CC
CC
CC
CC
CC
CC
IN
CC
OUT
CC
IN
CC
IN
CC
TABLE 1. DC ELECTRICAL SPECIFICATIONS
= 0.4V, V
= +2.0mA,
= -400µA,
= V
= V
= V
CONDITIONS
= 5.5V
= 4.5V
= 5.5V
= 4.5V
= 4.5V (Note 2)
= 4.5V (Note 2)
= 5.5V
= 5.5V
= 5.5V,
= 5.5V (Note 3)
= V
CC
CC
CC
o
CC
L
C to 125
or GND,
or GND,
or GND
= 40pF.
CC
OH
or GND,
HSP48410/883
+0.5V
≥ 1.5V, V
o
C
OL
SUBGROUP
GROUP A
≤ 1.5V, V
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
7, 8
Thermal Information
Thermal Resistance (Typical, Note 1)
Maximum Package Power Dissipation at 125
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . 175
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3,500
PGA Package. . . . . . . . . . . . . . . . . . . .
PGA Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.46
CCOP
IHC
= 3.4V and V
is 12mA/MHz. Maximum junction temperature must be
-55 ≤ T
-55 ≤ T
-55 ≤ T
-55 ≤ T
-55 ≤ T
-55 ≤ T
-55 ≤ T
-55 ≤ T
-55 ≤ T
-55 ≤ T
-55 ≤ T
TEMP (
A
A
A
A
A
A
A
A
A
A
A
ILC
≤ 125
≤ 125
≤ 125
≤ 125
≤ 125
≤ 125
≤ 125
≤ 125
≤ 125
≤ 125
≤ 125
o
C)
= 0.4V.
MIN
2.2
3.0
2.6
-10
-10
-
-
-
-
-
-
θ
JA
o
C
(
36
o
C/W) θ
MAX
500
308
0.8
0.8
0.4
10
10
-
-
-
-
o
C to 150
JC
UNITS
7.0
(
mA
µA
µA
µA
o
V
V
V
V
V
V
-
C/W)
o
o
o
C
C
C