AD9000SD AD [Analog Devices], AD9000SD Datasheet - Page 4
AD9000SD
Manufacturer Part Number
AD9000SD
Description
High Speed 6-Bit A/D Converter
Manufacturer
AD [Analog Devices]
Datasheet
1.AD9000SD.pdf
(8 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
AD9000SD/883
Manufacturer:
AD
Quantity:
101
Company:
Part Number:
AD9000SD/883B
Manufacturer:
INTERSIL
Quantity:
1 200
AD9000
DIE LAYOUT
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . . 129
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Metalization . . . . . . . . . . . . . . . . . . . . . . . 10,000Å Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –V
Passivation . . . . . . . . . . . . . . . . . . . . . . . . 10,000Å Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil Aluminum; Ultrasonic Bonding
–V
ANALOG GROUND Analog ground return. All grounds should be connected together near the AD9000.
V
ENCODE
–V
A
+V
+V
BIT 6 (LSB)
BIT 5 – BIT 2
BIT 1 (MSB)
OVERFLOW
DIGITAL GROUND Digital ground return. All grounds should be connected together near the AD9000.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD9000 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Pin Name
H
IN
S
REF
S
REF
Overflow data output. Logic high indicates an input overvoltage (A
Description
Negative supply terminal, nominally –5.2 V.
The hysteresis control voltage varies the comparator hysteresis from 15 mV to 50 mV, for a change of 0 V
to +3 V at the hysteresis control pin.
The ENCODE pin controls the conversion cycle. Encode is rising edge sensitive and should be driven
with a 50% duty-cycle waveform under normal conditions.
The most negative reference voltage for the internal resistor ladder.
Analog input pin.
Positive supply terminal, nominally +5.0 V.
Most positive reference voltage of the internal resistor ladder.
One of six digital outputs. BIT 6 (LSB) is the least-significant-bit of the digital output.
One of six digital outputs.
One of six digital outputs. BIT 1 (MSB) is the most-significant-bit of the digital output.
Device
AD9000JD
AD9000SD
AD9000SE
NOTES
1
2
MIL-STD-883 versions available, contact factory.
D = Ceramic DIP; E = Leadless Ceramic Chip Carrier.
or 1 mil Gold; Gold Ball Bonding
Temperature
Range
0 C to +70 C
–55 C to +125 C
–55 C to +125 C
217 15 ( 2) mils
ORDERING GUIDE
PIN DESCRIPTIONS
4 mils
S
–4–
Description
16-Pin DIP, Industrial
16-Pin DIP
28-Pin LCC
1
PIN DESIGNATIONS
IN
Package
D-16
Option
D-16
E-28A
+V
REF
2
).
WARNING!
ESD SENSITIVE DEVICE
REV. A