ADV7150LS135 AD [Analog Devices], ADV7150LS135 Datasheet - Page 33

• Manufacturer Part Number: ADV7150LS135
• Description: CMOS 220 MHz True-Color Graphics Triple 10-Bit Video RAM-DAC
• Manufacturer: AD [Analog Devices]

The ADV7150 is a very highly integrated monolithic silicon
device. This high level of integration, in such a small package,
inevitably leads to consideration of thermal and environmental
conditions in which the ADV7150 must operate. Reliability of
the device is significantly enhanced by keeping it as cool as pos-
sible. In order to avoid destructive damage to the device, the
absolute maximum junction temperature of 150 C must never
be exceeded. Certain applications, depending on pixel data
rates, may require forced air cooling, or external heatsinks. The
following data is intended as a guide in evaluating the operating
conditions of a particular application so that optimum device
and system performance is achieved.
It should be noted that information on package characteristics pub-
lished herein may not be the most up to date at the time of reading
this. Advances in package compounds and manufacture will inevita-
bly lead to improvements in the thermal data. Please contact your
local sales office for the most up-to-date information.
Power Dissipation
The diagram shows graphs of power dissipation in watts vs.
pixel clock frequency for the ADV7150.
Package Characteristics
The table of thermal characteristics shows typical information
for the ADV7150 (160-Lead Plastic Power QFP) using various
values of Airflow.
Junction to Case (
part is:
REV. A
NOTE: THE "WORST CASE ON-SCREEN PATTERN" CORRESPONDS TO FULL-SCALE
TRANSITION ON EACH PIXEL VALUE FOR EVERY CLOCK EDGE (00H, FFH, 00H, ... ).
THE "TYPICAL ON-SCREEN PATTERN" CORRESPONDS TO LINEAR CHANGES IN THE
PIXEL INPUT (I. E., A BLACK TO WHITE RAMP). IN GENERAL, COLOR IMAGES TEND
TO APPROXIMATE THIS CHARACTERISTIC.
(Note:
1.50
1.25
1.00
0.75
0.50
60
JC
Typical Power Dissipation vs. Pixel Rate
JC
is independent of airflow.)
V
V
T
(160-Lead Plastic Power QFP) = 1.0 C/W
80
AA
REF
A
= +25 C
= 5V
= 1.2V
100
PIXEL CLOCK FREQUENCY – MHz
JC
) Thermal Resistance for this particular
120
140
THERMAL AND ENVIRONMENTAL CONSIDERATIONS
160
180
200
220
APPENDIX 7
–33–
Air Velocity
(Linear feet/min)
Thermal Model
The junction temperature of the device in a specific application
is given by:
or
where:
T
T
P
Package Enhancements
The standard QFP package has been enhanced to a PowerQuad2
package. This supports an improved thermal performance com-
pared to standard QFP. In this case, the die is attached to
heatslug so that the power that is dissipated can be conducted to
the external surface of the package. This provides a highly effi-
cient path for the transfer of heat to the package surface. The
package configuration also provides an efficient thermal path
from the ADV7150 to the Printed Circuit Board via the leads.
Heatsinks
The maximum silicon junction temperature should be limited to
100 C. Temperatures greater than this will reduce long term
device reliability. To ensure that the silicon junction tempera-
ture stays within prescribed limits, the addition of an external
heatsink may be necessary. Heatsinks, will reduce
in the “Thermal Characteristics vs. Airflow” table.
JA
JC
CA
JA
J
A
D
No Heatsink
EG&G D10100-28 Heatsink 23
Thermalloy 2290 Heatsink
= Junction Temperature of Silicon ( C)
= Ambient Temperature ( C)
= Power Dissipation (W)
( C/W)
= Junction to Case Thermal Resistance ( C/W)
= Junction to Ambient Thermal Resistance ( C/W)
= Case to Ambient Thermal Resistance ( C/W)
Table A. Thermal Characteristics vs. Airflow
T
J
= T
T
J
A
= T
+ P
A
D
+ P
(
D
JC
0
(Still Air)
25.5
19
(
+
JA
)
CA
)
ADV7150
50
23
20
17
JA
as shown
100
21
18
15
(1)
(2)
200
19
16
12