EPM2210F100A ALTERA [Altera Corporation], EPM2210F100A Datasheet - Page 85
![no-image](/images/no-image-200.jpg)
EPM2210F100A
Manufacturer Part Number
EPM2210F100A
Description
MAX II Device Family
Manufacturer
ALTERA [Altera Corporation]
Datasheet
1.EPM2210F100A.pdf
(86 pages)
- Current page: 85 of 86
- Download datasheet (2Mb)
Software
Device Pin-Outs
Ordering Information
Figure 6–1. MAX II Device Packaging Ordering Information
© October 2008 Altera Corporation
MII51006-1.5
EPM:
Family Signature
MAX II
Blank (no identifier):
1270:
2210:
240:
570:
Indicates device type
Product-Line Suffix
Device Type
MAX
optional MAX+PLUS
entry, compilation and logic synthesis, full simulation and advanced timing analysis,
and device programming. Refer to the Design Software Selector Guide for more
details about the Quartus II software features.
The Quartus II software supports the Windows XP/2000/NT, Sun Solaris, Linux Red
Hat v8.0, and HP-UX operating systems. It also supports seamless integration with
industry-leading EDA tools through the NativeLink
Printed device pin-outs for MAX II devices are available on the Altera website
(www.altera.com).
Figure 6–1
about a specific package, refer to the
Handbook.
G:
Z:
M: Micro FineLine BGA
T:
F:
240 Logic Elements
570 Logic Elements
1,270 Logic Elements
2,210 Logic Elements
Package Type
Thin quad flat pack (TQFP)
FineLine BGA
1.8-V V
1.8-V V
2.5-V or 3.3-V V
®
II devices are supported by the Altera
EPM
CCINT
CCINT
describes the ordering codes for MAX II devices. For more information
zero-power device
low-power device
CCINT
device
240
®
II look and feel, which provides HDL and schematic design
6. Reference and Ordering Information
G
T
Number of pins for a particular package
Pin Count
100
Package Information
C
®
3, 4, 5, 6, or 7, with 3 being the fastest
C:
A:
Quartus
I:
Operating Temperature
Speed Grade
Commercial temperature (T
Industrial temperature (T
Automotive temperature (T
3
®
interface.
®
ES
II design software with new,
chapter in the MAX II Device
J
Indicates specific device
options or shipment method
ES:
N: Lead-free packaging
= -40
J
J
= -40
= 0
MAX II Device Handbook
Optional Suffix
Engineering sample
°
°
C to 100
°
C to 85
C to 125
°
°
C)
C)
°
C)
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