MK60FX512VLQ15 FREESCALE [Freescale Semiconductor, Inc], MK60FX512VLQ15 Datasheet - Page 24

• Manufacturer Part Number: MK60FX512VLQ15
• Description: K60 Sub-Family Data Sheet
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Peripheral operating requirements and behaviors
5.4.2 Thermal attributes
1.
2.
3.
4.
6 Peripheral operating requirements and behaviors
24
Single-layer
(1s)
Four-layer
(2s2p)
Single-layer
(1s)
Four-layer
(2s2p)
—
—
—
Board type
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
R
R
R
R
R
R
Ψ
Symbol
θJA
θJA
θJMA
θJMA
θJB
θJC
JT
K60 Sub-Family Data Sheet Data Sheet, Rev. 3, 2/2012.
Thermal
resistance,
junction to
ambient (natural
convection)
Thermal
resistance,
junction to
ambient (natural
convection)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
ambient (200 ft./
min. air speed)
Thermal
resistance,
junction to
board
Thermal
resistance,
junction to case
Thermal
characterization
parameter,
junction to
package top
outside center
(natural
convection)
Description
45
36
36
30
24
9
2
144 LQFP
Preliminary
50
30
41
27
17
10
2
MAPBGA
144
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor, Inc.
1
1
1
1
2
3
4
Notes