MK60DN256ZVMD10 FREESCALE [Freescale Semiconductor, Inc], MK60DN256ZVMD10 Datasheet - Page 23

• Manufacturer Part Number: MK60DN256ZVMD10
• Description: K60 Sub-Family Data Sheet
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

2.
3.
4.
6 Peripheral operating requirements and behaviors
6.1 Core modules
6.1.1 Debug trace timing specifications
Freescale Semiconductor, Inc.
TRACE_CLKOUT
TRACE_D[3:0]
Symbol
T
T
T
T
T
T
T
cyc
wh
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
wl
s
h
r
f
Clock period
Low pulse width
High pulse width
Clock and data rise time
Clock and data fall time
Data setup
Data hold
Description
K60 Sub-Family Data Sheet Data Sheet, Rev. 6, 9/2011.
Table 12. Debug trace operating behaviors
Figure 3. TRACE_CLKOUT specifications
Figure 4. Trace data specifications
Ts
Th
Peripheral operating requirements and behaviors
Frequency dependent
Min.
Ts
—
—
2
2
3
2
Th
Max.
—
—
—
—
3
3
MHz
Unit
ns
ns
ns
ns
ns
ns
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