CY8C20140_09 CYPRESS [Cypress Semiconductor], CY8C20140_09 Datasheet - Page 12

• Manufacturer Part Number: CY8C20140_09
• Description: CapSense Express-4 Configurable IOs
• Manufacturer: CYPRESS [Cypress Semiconductor]

Ordering Information
Thermal Impedances by Package
Solder Reflow Peak Temperature
Document Number: 001-17348 Rev. *F
CY8C20140-LDX2I
CY8C20140-SX2I
Notes
3. T
4. Higher temperatures may be required based on the solder melting point. Typical temperatures for solder are 220 ± 5°C with Sn-Pb or 245 ± 5°C with Sn-Ag-Cu paste.
5. Earlier termed as QFN package.
SDA
SCL
Refer to the solder manufacturer specifications.
J
t
= T
f
A
Ordering Code
S
+ Power x θ
16 COL
Package
16 SOIC
t
t
HDSTAI2C
LOWI2C
JA.
[5]
16 COL
Package
16 SOIC
t
Figure 3. Definition of Timing for Fast/Standard Mode on the I
r
t
HDDATI2C
[5]
001-09116
51-85068
t
SUDATI2C
Package Diagram
Minimum Peak Temperature
t
HIGHI2C
t
f
240 °C
240 °C
t
SUSTAI2C
16 COL
16 SOIC
Sr
[4]
Package Type
[5]
t
HDSTAI2C
Typical θ
79.96 °C
Maximum Peak Temperature
46 °C
2
C Bus
t
Industrial
Industrial
SPI2C
t
SUSTOI2C
JA
[3]
Operating Temperature
260 °C
260 °C
t
r
P
CY8C20140
t
BUFI2C
Page 12 of 15
S
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