CY8C38_11 CYPRESS [Cypress Semiconductor], CY8C38_11 Datasheet - Page 121
CY8C38_11
Manufacturer Part Number
CY8C38_11
Description
Manufacturer
CYPRESS [Cypress Semiconductor]
Datasheet
1.CY8C38_11.pdf
(129 pages)
- Current page: 121 of 129
- Download datasheet (5Mb)
Document Number: 001-11729 Rev. *R
LASER MARK
PIN 1 DOT
1.
2. REFERENCE JEDEC#: MO-220
3. PACKAGE WEIGHT: 0.17g
4. ALL DIMENSIONS ARE IN MILLIMETERS
NOTES:
1
7
1
HATCH AREA IS SOLDERABLE EXPOSED METAL.
1
8
6
8
Figure 13-3. 68-pin QFN 8×8 with 0.4 mm Pitch Package Outline (Sawn Version)
8.000±0.100
TOP VIEW
Figure 13-4. 100-pin TQFP (14 × 14 × 1.4 mm) Package Outline
5
2
3
4
5
1
3
5
0.900±0.100
SIDE VIEW
0.200 REF
0.05 MAX
5.7±0.10
0.400±0.100
0.20±0.05
3
5
5
1
PSoC
5
2
3
4
SOLDERABLE
EXPOSED
BOTTOM VIEW
®
6.40 REF
0.400 PITCH
PAD
5.7±0.10
3: CY8C38 Family
51-85048 *E
6
8
1
8
Data Sheet
001-09618 *C
Page 121 of 129
1
7
1
PIN1 ID
R 0.20
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