HS1-54C138RH-8 INTERSIL [Intersil Corporation], HS1-54C138RH-8 Datasheet

HS1-54C138RH-8

Manufacturer Part Number

HS1-54C138RH-8

Description

Radiation Hardened 3-Line to 8-Line Decoder/Demultiplexer

Manufacturer

INTERSIL [Intersil Corporation]

Datasheet

1.HS1-54C138RH-8.pdf (4 pages)

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Radiation Hardened 3-Line to 8-Line

Decoder/Demultiplexer

The Intersil HS-54C138RH is a radiation hardened 3- to

8-line decoder fabricated using a radiation hardened

EPI-CMOS process. It features low power consumption,

high noise immunity, and high speed. Also featured are pin

and function compatibility with the 54LS138 industry

standard part. The HS-54C138RH is ideally suited for high

speed memory chip select address decoding. It is intended

for use with the Intersil HS-80C85RH radiation hardened

microprocessor, but it can also be utilized as a demultiplexer

in any low power rad-hard application.

The HS-54C138RH contains a one of eight binary decoder.

A three bit binary input is used to select and activate each of

the eight outputs, provided the three chip enable inputs are

also present (see truth table).

The HS-54C138RH has an on-chip enable gate. The active

high (G1) and both active low (G2A, G2B) inputs are Anded

together to provide a single enable input to the device. The

use of both active high and active low inputs minimizes the

need for external gates when expanding a system.

Specifications for Rad Hard QML devices are controlled

by the Defense Supply Center in Columbus (DSCC). The

SMD numbers listed here must be used when ordering.

Detailed Electrical Specifications for these devices are

contained in SMD 5962-95825. A “hot-link” is provided

on our homepage for downloading.

www.intersil.com/spacedefense/space.asp

Ordering Information

5962R9582501QEC

5962R9582501QXC

5962R9582501V9A

5962R9582501VEC

5962R9582501VXC

ORDERING NUMBER

HS1-54C138RH-8

HS9-54C138RH-8

HS0-54C138RH-Q

HS1-54C138RH-Q

HS9-54C138RH-Q

MKT. NUMBER

INTERNAL

Data Sheet

TEMP. RANGE

-55 to 125

(

1-888-INTERSIL or 321-724-7143

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

Features

• Electrically Screened to SMD # 5962-95825

• QML Qualified per MIL-PRF-38535 Requirements

• Radiation Hardened EPI-CMOS

• Multiple Input Enable for Easy Expansion

• Single Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . .+5V

• Outputs Active Low

• Low Standby Power . . . . . . . . . . . . . . .0.5mW Max at +5V

• High Noise Immunity

• Equivalent to Sandia SA2995

• Bus Compatible with Intersil Rad-Hard 80C85RH

• Full Military Temperature Range . . . . . . . -55

Pinouts

- Total Dose . . . . . . . . . . . . . . . . . . . . . . 1 x 10

- Latch-Up Immune . . . . . . . . . . . . . . >1 x 10

GND

G2A

G2B

August 2000

Intersil (and design) is a registered trademark of Intersil Americas Inc.

FLATPACK PACKAGE (FLATPACK)

16 LEAD CERAMIC DUAL-IN-LINE

METAL SEAL PACKAGE (SBDIP)

16 LEAD CERAMIC METAL SEAL

GND

G2A

G2B

MIL-STD-1835 CDFP4-F16

MIL-STD-1835 CDIP2-T16

TOP VIEW

HS-54C138RH

File Number

VDD

C to 125

RAD(Si)/s

3037.3

RAD(Si)

VDD

Related parts for HS1-54C138RH-8

HS1-54C138RH-8 Summary of contents

Page 1

... SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-95825. A “hot-link” is provided on our homepage for downloading. www.intersil.com/spacedefense/space.asp Ordering Information INTERNAL ORDERING NUMBER MKT. NUMBER 5962R9582501QEC HS1-54C138RH-8 5962R9582501QXC HS9-54C138RH-8 5962R9582501V9A HS0-54C138RH-Q 5962R9582501VEC HS1-54C138RH-Q 5962R9582501VXC HS9-54C138RH-Q 1 ...

Page 2

Typical Applications Typical applications include systems which require multiple input/output ports and memories. When the HS-54C138RH is enabled one of the eight outputs will go low. This output can be used to select a particular device or a group of ...

Page 3

DATA EN EN INPUT G1 G2B G2A FIGURE ...

Page 4

Die Characteristics DIE DIMENSIONS: 76 mils x 63 mils x 14 mils ±1 mil ASSEMBLY RELATED INFORMATION: Substrate Potential: Unbiased (DI) INTERFACE MATERIALS: Glassivation: Type: SiO2 Thickness: 8kÅ ±1kÅ Metallization Mask Layout Y5 (10) Y4 (11) Y3 (12) Y2 (13) ...

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