XTR108EA-2K5 BURR-BROWN [Burr-Brown Corporation], XTR108EA-2K5 Datasheet - Page 27

• Manufacturer Part Number: XTR108EA-2K5
• Manufacturer: BURR-BROWN [Burr-Brown Corporation]

www.ti.com
PACKAGING INFORMATION
(1)
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
The marketing status values are defined as follows:
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
XTR108EA/2K5G4
Orderable Device
XTR108EA/2K5
XTR108EAG4
XTR108EA
Status
ACTIVE
ACTIVE
ACTIVE
ACTIVE
(1)
Package Type Package
SSOP
SSOP
SSOP
SSOP
Drawing
DBQ
DBQ
DBQ
DBQ
Pins
24
24
24
24
Package Qty
Addendum-Page 1
2500
2500
50
50
Green (RoHS
Green (RoHS
Green (RoHS
Green (RoHS
Eco Plan
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
(2)
CU NIPDAU Level-3-260C-168 HR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-3-260C-168 HR
Ball Finish
Lead/
PACKAGE OPTION ADDENDUM
http://www.ti.com/productcontent
MSL Peak Temp
(3)
(Requires Login)
for the latest availability
Samples
16-Aug-2012