HCPL-050L-060 HP [Agilent(Hewlett-Packard)], HCPL-050L-060 Datasheet - Page 4
![no-image](/images/no-image-200.jpg)
HCPL-050L-060
Manufacturer Part Number
HCPL-050L-060
Description
LVTTL/LVCMOS Compatible 3.3 V Optocouplers (1 Mb/s)
Manufacturer
HP [Agilent(Hewlett-Packard)]
Datasheet
1.HCPL-050L-060.pdf
(11 pages)
Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
4
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
300
200
100
smax
smax
smin
0
T
T
25
0
p
L
= 200 °C, T
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
150 - 200 °C
217 °C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
50
RAMP-UP
= 150 °C
t
3°C + 1°C/–0.5°C
s
150°C, 90 + 30 SEC.
260 +0/-5 °C
PREHEATING TIME
TIME
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
TEMP.
PEAK
245°C
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
150
SEC.
SEC.
30
30
50 SEC.
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The devices contained in this
data sheet have been approved by
the following organizations:
UL
Approval under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approval under CSA Component
Acceptance
Notice #5, File CA 88324.
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01