ADG659YCP-REEL7 AD [Analog Devices], ADG659YCP-REEL7 Datasheet - Page 19

• Manufacturer Part Number: ADG659YCP-REEL7
• Manufacturer: AD [Analog Devices]

OUTLINE DIMENSIONS
INDICATOR
1.00
0.85
0.80
PIN 1
0.15
0.05
12° MAX
SEATING
PLANE
4.50
4.40
4.30
PIN 1
Figure 32. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.65
Figure 33. 16-Lead Lead Frame Chip Scale Package [LFCSP]
BSC SQ
16
VIEW
TOP
1
4.0
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
0.80 MAX
0.65 TYP
COMPLIANT TO JEDEC STANDARDS MO-153AB
5.10
5.00
4.90
0.35
0.28
0.25
0.10
Dimensions shown in millimeters
Dimensions shown in millimeters
0.30
0.19
BSC SQ
0.20 REF
3.75
9
8
Rev. A | Page 19 of 20
1.20
MAX
SEATING
PLANE
BSC
6.40
0.05 MAX
0.02 NOM
(CP-16-4)
( RU-16)
0.60 MAX
0.65 BSC
0.20
0.09
COPLANARITY
0.75
0.60
0.50
0.08
8°
0°
12
9
13
(BOTTOM VIEW)
8
EXPOSED
0.60 MAX
PAD
16
5
1
4
1.95 BSC
0.75
0.60
0.45
2.25
2.10 SQ
1.95
0.25 MIN
PIN 1
INDICATOR
ADG658/ADG659