ADA4310 AD [Analog Devices], ADA4310 Datasheet - Page 5

• Manufacturer Part Number: ADA4310
• Description: Low Cost, Dual, High Current Output Line Driver with Shutdown
• Manufacturer: AD [Analog Devices]

ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Supply Voltage
Power Dissipation
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
specified for device soldered in circuit board for surface-mount
packages.
Table 3.
Package Type
10-Lead MINI_SO_EP
16-Lead LFCSP_VQ
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate
on the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
JA
10-Lead MINI_SO_EP
16-Lead LFCSP_VQ
is specified for the worst-case conditions, that is, θ
θ
44
63
JA
Rating
12 V
±6V
(T
−65°C to +125°C
−40°C to +85°C
300°C
150°C
JMAX
Unit
°C/W
°C/W
− T
JA
A
)/θ
is
JA
Rev. 0 | Page 5 of 16
Maximum Power Dissipation
The maximum safe power dissipation for the ADA4310-1 is
limited by the associated rise in junction temperature (T
the die. At approximately 150°C, which is the glass transition
temperature, the plastic changes its properties. Even temporarily
exceeding this temperature limit can change the stresses that the
package exerts on the die, permanently shifting the parametric
performance of the amplifiers. Exceeding a junction temperature of
150°C for an extended period can result in changes in silicon
devices, potentially causing degradation or loss of functionality.
Figure 4 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 10-lead
MINI_SO_EP (44°C/W) and for the 16-lead LFCSP_VQ
(63°C/W) on a JEDEC standard 4-layer board. θ
approximations.
Figure 4. Maximum Power Dissipation vs. Temperature for a 4-Layer Board
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
–35
LFCSP_VQ-16
–15
AMBIENT TEMPERATURE (°C)
5
MINI_SO_EP-10
25
45
ADA4310-1
65
JA
values are
85
J
) on