EL5323 INTERSIL [Intersil Corporation], EL5323 Datasheet - Page 11

• Manufacturer Part Number: EL5323
• Description: 12MHz 4-, 8-, 10- and 12-Channel Rail-to-Rail Input-Output Buffers
• Manufacturer: INTERSIL [Intersil Corporation]

Typical Performance Curves
FIGURE 21. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 19. LARGE SIGNAL TRANSIENT RESPONSE
1V/DIV
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
JEDEC JESD51-3 AND SEMI G42-88
(SINGLE LAYER) TEST BOARD
714mW
TEMPERATURE
θ
JA
= +140°C/W
25
QFN24
AMBIENT TEMPERATURE (°C)
758mW
50
11
FIGURE 23. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE
1µs/DIV
θ
JA
75
= +132°C/W
QFN32
85
100
EL5123, EL5223, EL5323, EL5423
(Continued)
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
125
0
0
JEDEC JESD51-3 LOW EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
714mW
486mW
θ
JA
150
MSOP10
= +206°C/W
25
θ
JA
AMBIENT TEMPERATURE (°C)
TSSOP20
= +140°C/W
50
833mW
781mW
75
θ
JA
TSSOP24
85
= +128°C/W
FIGURE 20. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 22. PACKAGE POWER DISSIPATION vs AMBIENT
100
θ
JA
TSSOP28
= +120°C/W
3.0
2.5
2.0
1.5
1.0
0.5
1.4
1.2
1.0
0.8
0.6
0.4
0.2
125
0
0
0
0
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD, QFN EXPOSED
DIEPAD SOLDERED TO PCB PER JESD51-5
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
2.703W
TEMPERATURE
1.333W
1.111W
870mW
TEMPERATURE
θ
JA
θ
JA
TSSOP20
150
= +95°C/W
QFN24
25
25
= +37°C/W
AMBIENT TEMPERATURE (°C)
AMBIENT TEMPERATURE (°C)
θ
JA
MSOP10
2.857W
= +115°C/W
50
50
1.176W
θ
θ
75
75
JA
JA
TSSOP24
85
85
QFN32
= +35°C/W
= +85°C/W
100
100
θ
JA
TSSOP28
= +75°C/W
125
125
August 31, 2010
150
150
FN7176.3