25LC256-EMF MICROCHIP [Microchip Technology], 25LC256-EMF Datasheet

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25LC256-EMF

Manufacturer Part Number
25LC256-EMF
Description
256K SPI Bus Serial EEPROM
Manufacturer
MICROCHIP [Microchip Technology]
Datasheet
Device Selection Table
Features
• Max. clock 10 MHz
• Low-power CMOS technology
• 32,768 x 8-bit organization
• 64 byte page
• Self-timed ERASE and WRITE cycles (5 ms
• Block write protection
• Built-in write protection
• Sequential read
• High reliability
• Temperature ranges supported;
• Standard and Pb-free packages available
Pin Function Table
 2003 Microchip Technology Inc.
* 25XX256 is used in this document as a generic part number for the 25AA256, 25LC256 devices.
- Max. Write Current: 5 mA at 5.5V, 10 MHz
- Read Current: 5 mA at 5.5V, 10 MHz
- Standby Current: 1 A at 5.5V
max.)
- Protect none, 1/4, 1/2 or all of array
- Power-on/off data protection circuitry
- Write enable latch
- Write-protect pin
- Endurance: 1,000,000 erase/write cycles
- Data retention: > 200 years
- ESD protection: > 4000V
- Industrial (I):
- Automotive (E):
Part Number
HOLD
Name
SCK
V
V
WP
25AA256
SO
25LC256
CS
SI
CC
SS
Chip Select Input
Serial Data Output
Write-Protect
Ground
Serial Data Input
Serial Clock Input
Hold Input
Supply Voltage
V
256K SPI
CC
2.5-5.5V
1.8-5.5V
Function
Range
-40 C to +85 C
-40°C to +125°C
25AA256/25LC256
Page Size
Bus Serial EEPROM
64 Byte
64 Byte
Preliminary
SPI is a registered trademark of Motorola Corporation.
Description
The Microchip Technology Inc. 25AA256/25LC256
(25XX256
PROMs. The memory is accessed via a simple Serial
Peripheral Interface™ (SPI™) compatible serial bus.
The bus signals required are a clock input (SCK) plus
separate data in (SI) and data out (SO) lines. Access to
the device is controlled through a Chip Select (CS)
input.
Communication to the device can be paused via the
hold pin (HOLD). While the device is paused,
transitions on its inputs will be ignored, with the
exception of Chip Select, allowing the host to service
higher priority interrupts.
The 25XX256 is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead DFN and 8-lead TSSOP.
Pb-free (Pure Sn) finish is also available.
Package Types (not to scale)
V
WP
CS
SO
SS
Temp. Ranges
1
2
3
4
TSSOP
I, E
*
) are 256k-bit Serial Electrically Erasable
I
(ST)
V
WP
SO
CS
SS
8
7
6
5
1
2
3
4
V
HOLD
SCK
SI
CC
DFN
(MF)
V
WP
SO
CS
SS
P, SN, ST, MF
P, SN, ST, MF
PDIP/SOIC
Packages
8
7
6
5
1
2
3
4
(P, SN)
V
HOLD
SCK
SI
CC
DS21822C-page 1
8
7
6
5
V
HOLD
SCK
SI
CC

Related parts for 25LC256-EMF

25LC256-EMF Summary of contents

Page 1

... SI Serial Data Input SCK Serial Clock Input HOLD Hold Input V Supply Voltage CC * 25XX256 is used in this document as a generic part number for the 25AA256, 25LC256 devices.  2003 Microchip Technology Inc. 25AA256/25LC256 ™ Bus Serial EEPROM Page Size Temp. Ranges 64 Byte Byte ...

Page 2

... ELECTRICAL CHARACTERISTICS (†) Absolute Maximum Ratings V .............................................................................................................................................................................6.5V CC All inputs and outputs w.r.t. V ......................................................................................................... -0. Storage temperature .................................................................................................................................-65°C to 150°C Ambient temperature under bias ...............................................................................................................-40°C to 125°C ESD protection on all pins ..........................................................................................................................................4 kV † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device ...

Page 3

... This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please consult the Total Endurance™ Model which can be obtained from our web site: www.microchip.com.  2003 Microchip Technology Inc. 25AA256/25LC256 Industrial (I -40°C to +85°C A Automotive (E -40° ...

Page 4

... TABLE 1-2: AC CHARACTERISTICS (CONTINUED) AC CHARACTERISTICS Param. Sym. Characteristic No HOLD Hold Time HOLD Low to Output HZ High HOLD High to Output HV Valid 20 T Internal Write Cycle Time WC 21 — Endurance Note 1: This parameter is periodically sampled and not 100% tested begins on the rising edge of CS after a valid write sequence and ends when the internal write cycle is WC complete ...

Page 5

... FIGURE 1-2: SERIAL INPUT TIMING CS 2 Mode 1,1 SCK Mode 0 MSB in SO FIGURE 1-3: SERIAL OUTPUT TIMING SCK 13 MSB out SO SI  2003 Microchip Technology Inc. 25AA256/25LC256 high-impedance n don’t care high-impedance 14 don’t care Preliminary ...

Page 6

... FUNCTIONAL DESCRIPTION 2.1 Principles of Operation The 25XX256 is a 32768 byte Serial EEPROM designed to interface directly with the Serial Peripheral Interface (SPI) port of many of today’s popular microcontroller families, including ® PICmicro microcontrollers. It may also interface with microcontrollers that do not have a built-in SPI port by using discrete I/O lines programmed properly in firmware to match the SPI protocol ...

Page 7

... SI high-impedance SO  2003 Microchip Technology Inc. 25AA256/25LC256 HV Generator EEPROM Array Page Latches Y Decoder Sense Amp. R/W Control Read data from memory array beginning at selected address Write data to memory array beginning at selected address Reset the write enable latch (disable write operations) ...

Page 8

... FIGURE 2-2: BYTE WRITE SEQUENCE SCK instruction high-impedance SO FIGURE 2-3: PAGE WRITE SEQUENCE SCK instruction SCK data byte ...

Page 9

... FIGURE 2-5: WRITE DISABLE SEQUENCE (WRDI) CS SCK SI SO  2003 Microchip Technology Inc. 25AA256/25LC256 The following is a list of conditions under which the write enable latch will be reset: • Power-up See • WRDI instruction successfully executed • WRSR instruction successfully executed • WRITE instruction successfully executed ...

Page 10

... Read Status Register Instruction (RDSR) The Read Status Register instruction (RDSR) provides access to the Status register. The Status register may be read at any time, even during a write cycle. The Status register is formatted as follows: TABLE 2-2: STATUS REGISTER W/R – – ...

Page 11

... WRITE STATUS REGISTER TIMING SEQUENCE (WRSR SCK instruction Note: An internal write cycle (T WC  2003 Microchip Technology Inc. 25AA256/25LC256 See Figure 2-7 for the WRSR timing sequence. TABLE 2-3: BP1 data to Status register 0 0 ...

Page 12

... Data Protection The following protection has been implemented to prevent inadvertent writes to the array: • The write enable latch is reset on power-up • A write enable instruction must be issued to set the write enable latch • After a byte write, page write or Status register write, the write enable latch is reset • ...

Page 13

... If an internal write cycle has already begun, WP going low will have no effect on the write.  2003 Microchip Technology Inc. 25AA256/25LC256 The WP pin function is blocked when the WPEN bit in the Status register is low. This allows the user to install the 25XX256 in a system with WP pin grounded and still be able to write to the Status register ...

Page 14

... Custom marking available. DS21822C-page 14 : Example 25LC256 I/MF 0328 1L7 Example: 25AA256 I/P 1L7 0328 Example: 25LC256 I/SN 0328 1L7 Example: TSSOP 1st Line Marking Codes 5LE Device I328 1L7 25AA256 25LC256 Preliminary  2003 Microchip Technology Inc. Pb-free std mark mark 5AE NAE 5LE NLE ...

Page 15

... Mold Draft Angle Top *Controlling Parameter Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC equivalent: pending Drawing No. C04-113  2003 Microchip Technology Inc. 25AA256/25LC256 EXPOSED METAL PADS ...

Page 16

... Plastic Dual In-line (P) – 300 mil (PDIP Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width ...

Page 17

... Mold Draft Angle Bottom * Controlling Parameter § Significant Characteristic Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057  2003 Microchip Technology Inc. 25AA256/25LC256 Units ...

Page 18

... Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...

Page 19

... APPENDIX A: REVISION HISTORY Revision C Corrections to Section 1.0, Electrical Characteristics.  2003 Microchip Technology Inc. 25AA256/25LC256 Preliminary DS21822C-page 19 ...

Page 20

... NOTES: DS21822C-page 20 Preliminary  2003 Microchip Technology Inc. ...

Page 21

... Conferences for products, Development Systems, technical information and more • Listing of seminars and events  2003 Microchip Technology Inc. 25AA256/25LC256 SYSTEMS INFORMATION AND UPGRADE HOT LINE The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products ...

Page 22

... Telephone: (_______) _________ - _________ Application (optional): Would you like a reply? Y Device: 25AA256/25LC256 Questions: 1. What are the best features of this document? 2. How does this document meet your hardware and software development needs you find the organization of this document easy to follow? If not, why? 4 ...

Page 23

... EEPROM, Industrial temp., Tape & Reel, SOIC package 25AA256T-I/ST = 256k-bit, 1.8V Serial EEPROM, Industrial temp., Tape & Reel, TSSOP package 25LC256-I/STG = 256k-bit, 2.5V Serial EEPROM, Industrial temp., TSSOP package, Pb-free 25LC256-I/P = 256k-bit, 2.5V Serial EEPROM, Industrial temp., P-DIP package 25LC256T-E/ST = 256k-bit, 2.5V Serial EEPROM, Extended temp., Tape & Reel, ...

Page 24

... NOTES: DS21822C-page 24 Preliminary  2003 Microchip Technology Inc. ...

Page 25

... QS-9000 compliant for its PICmicro ® 8-bit MCUs devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified. Preliminary PowerCal, PowerInfo, rfLAB, rfPIC, ...

Page 26

W ORLDWIDE AMERICAS Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com Atlanta 3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640-0034 Fax: 770-640-0307 Boston 2 Lan Drive, Suite ...

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