25LC256-EMF MICROCHIP [Microchip Technology], 25LC256-EMF Datasheet - Page 15

• Manufacturer Part Number: 25LC256-EMF
• Description: 256K SPI Bus Serial EEPROM
• Manufacturer: MICROCHIP [Microchip Technology]

8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S)
 2003 Microchip Technology Inc.
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC equivalent: pending
Drawing No. C04-113
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Base Thickness
Overall Length
Molded Package Length
Exposed Pad Length
Overall Width
Molded Package Width
Exposed Pad Width
Lead Width
Lead Length
Tie Bar Width
Mold Draft Angle Top
A1
n
1
TOP VIEW
2
E1
E
Dimension Limits
Units
D1
D2
A2
A1
A3
E1
E2
D
R
A
E
B
D1
n
p
L
A2
D
A3
MIN
.000
.152
.085
.014
.020
Preliminary
A
.008 REF.
INCHES
.050 BSC
.194 BSC
.184 BSC
.236 BSC
.226 BSC
NOM
EXPOSED
.0004
.033
.026
.158
.091
.016
.024
.014
METAL
PADS
8
25AA256/25LC256
MAX
R
.039
.031
.002
.163
.097
.019
.030
12
B
BOTTOM VIEW
MIN
E2
0.00
3.85
2.16
0.35
0.50
MILLIMETERS*
p
0.20 REF.
1.27 BSC
4.92 BSC
4.67 BSC
5.99 BSC
5.74 BSC
NOM
0.85
0.65
0.01
4.00
2.31
0.40
0.60
.356
PIN 1
L
DS21822C-page 15
8
ID
D2
MAX
1.00
0.80
0.05
4.15
2.46
0.47
0.75
12