M95512-D-RCS3G/AB STMICROELECTRONICS [STMicroelectronics], M95512-D-RCS3G/AB Datasheet - Page 42

• Manufacturer Part Number: M95512-D-RCS3G/AB
• Description: 512 Kbit serial SPI bus EEPROM with high-speed clock
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package mechanical data
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Figure 26. WLCSP-R – 8-bump wafer-length chip-scale package outline
1. Drawing is not to scale.
Table 22.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
2. Measured at the maximum bump diameter parallel to primary datum Z.
A
A1
A2
b
D
E
e
e1
e2
e3
F
G
N (number of terminals)
aaa
eee
(2)
Symbol
Orientation reference
eee Z
WLCSP-R – 8-bump wafer-length chip-scale package mechanical data
Bump
Wafer back side
0.230
0.350
0.580
0.322
1.433
1.901
1.000
0.866
0.500
0.433
0.284
0.453
D
Typ
8
Doc ID 11124 Rev 13
b
X
millimeters
E
Y
0.490
0.110
0.060
aaa
Min
A1
Seating plane
A2
Side view
A
Z
Detail A
rotated by 90 °C
0.670
1.548
2.016
Max
Detail A
Orientation reference
0.0228
0.0091
0.0138
0.0127
0.0564
0.0748
0.0394
0.0341
0.0197
0.0170
0.0112
0.0178
Typ
A
B
C
D
E
8
1
M95512-W, M95512-R
2
e1
inches
F
Bump side
0.0193
0.0043
0.0024
3
Min
e3
(1)
ME_1Cc
G
e2
e
0.0264
0.0609
0.0794
Max