EL7581_06 INTERSIL [Intersil Corporation], EL7581_06 Datasheet - Page 9

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EL7581_06

Manufacturer Part Number
EL7581_06
Description
3-Channel DC/DC Converter
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet
Typical Performance Curves
FIGURE 25. POWER-DOWN, 100K AND 0.1µF DELAY
FIGURE 29. 20-PIN HTSSOP THERMAL RESISTANCE vs PCB
FIGURE 27. LX WAVEFORM - DISCONTINUOUS MODE
C
SS
50
45
40
35
30
25
1
= 0.1µF
NETWORK ON ENP
AREA, NO AIR FLOW
2
V
V
I
OUT
10V/DIV
OUT
IN
5V/DIV
2V/DIV
20-PIN HTSSOP THERMAL PAD
SOLDERED TO 2-LAYER PCB WITH
0.039" THICKNESS AND 1-oz COPPER
ON BOTH SIDES
CONDITION:
= 3.3V
3
= 50mA
= 11.3V
200ms/DIV
PCB AREA (in
4
9
5
6
2
)
(Continued)
7
8
V
V
V
ON
OFF
BOOST
9
EL7581
FIGURE 26. POWER-UP, 100K AND 0.1µF DELAY NETWORK
FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 28. LX WAVEFORM - CONTINUOUS MODE
C
3.5
2.5
1.5
0.5
SS
5V/div
3
2
1
0
0
= 0.1µF
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
HTSSOP EXPOSED DIEPAD SOLDERED TO PCB
PER JESD51-5
2.857W
ON ENP
TEMPERATURE
25
V
V
I
OUT
IN
OUT
AMBIENT TEMPERATURE (°C)
= 3.3V
= 250mA
= 11.3V
50
1ms/DIV
75
85
10V/DIV
2V/DIV
100
125
V
V
V
BOOST
ON
OFF
150

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