HCS109HMSR INTERSIL [Intersil Corporation], HCS109HMSR Datasheet
HCS109HMSR
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HCS109HMSR Summary of contents
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... SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS109DMSR HCS109KMSR HCS109D/Sample HCS109K/Sample HCS109HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HCS109MS Pinouts MIL-STD-1835 CDIP2-T16, LEAD FINISH C 2 /mg ...
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Functional Diagram 5 (11 (14 (13 (12 (15 VCC GND *Unpredictable and ...
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Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
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TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS (NOTES 1, 2) PARAMETER SYMBOL CONDITIONS TPLH VCC = 4.5V VCC = 4.5V TPHL VCC = 4.5V VCC = 4. TPLH VCC = 4.5V VCC = 4.5V ...
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TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Quiescent Current ICC VCC = 5.5V, VIN = VCC or GND Output Current (Sink) IOL VCC = 4.5V, VIN = VCC or GND, VOUT = 0.4V Output Current IOH VCC ...
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CONFORMANCE GROUPS Initial Test (Preburn-In) Interim Test I (Postburn-In) Interim Test II (Postburn-In) PDA Interim Test III (Postburn-In) PDA Final Test Group A (Note 1) Group B Subgroup B-5 Subgroup B-6 Group D NOTES: 1. Alternate group A testing in ...
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Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
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AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 Pulse Width, Setup, Hold Timing Diagram Positive ...
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Die Characteristics DIE DIMENSIONS mils 2.25 x 2.24mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY <2 A/cm BOND ...