HCS154D INTERSIL [Intersil Corporation], HCS154D Datasheet
HCS154D
Available stocks
Related parts for HCS154D
HCS154D Summary of contents
Page 1
... The HCS154MS is supplied lead Ceramic flatpack (K suffi SBDIP Package (D suffix). Ordering Information PART NUMBER TEMPERATURE RANGE HCS154DMSR HCS154KMSR HCS154D/Sample HCS154K/Sample HCS154HMSR CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 HCS154MS 4-to-16 Line Decoder/Demultiplexer ...
Page 2
Functional Diagram INPUTS ...
Page 3
Absolute Maximum Ratings Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +7.0V Input Voltage ...
Page 4
TABLE 2. AC ELECTRICAL PERFORMANCE CHARACTERISTICS PARAMETER SYMBOL Address to Output TPLH VCC = 4.5V TPHL VCC = 4.5V Enable to Output TPLH VCC = 4.5V TPHL NOTES: 1. All voltages referenced to device GND measurements assume RL ...
Page 5
TABLE 4. DC POST RADIATION ELECTRICAL PERFORMANCE CHARACTERISTICS (Continued) PARAMETERS SYMBOL Output Voltage High VOH VCC = 4.5V or 5.5V, VIH = 0.70(VCC), VIL = 0.30(VCC), IOH = -50 A Input Leakage Current IIN VCC = 5.5V, VIN = VCC ...
Page 6
CONFORMANCE GROUPS METHOD Group E Subgroup 2 5005 NOTE: 1. Except FN test which will be performed 100% Go/No-Go. TABLE 8. STATIC AND DYNAMIC BURN-IN TEST CONNECTIONS OPEN GROUND STATIC BURN-IN I TEST CONDITIONS (Note 11, 13 ...
Page 7
Intersil Space Level Product Flow - ‘MS’ Wafer Lot Acceptance (All Lots) Method 5007 (Includes SEM) GAMMA Radiation Verification (Each Wafer) Method 1019, 4 Samples/Wafer, 0 Rejects 100% Nondestructive Bond Pull, Method 2023 Sample - Wire Bond Pull Monitor, Method ...
Page 8
AC Timing Diagrams VIH INPUT VS VIL TPLH VOH VS OUTPUT VOL TTLH VOH 80% 20% OUTPUT VOL AC VOLTAGE LEVELS PARAMETER HCS VCC 4.50 VIH 4.50 VS 2.25 VIL 0 GND 0 All Intersil semiconductor products are manufactured, assembled ...
Page 9
Die Characteristics DIE DIMENSIONS 101 mils 2.16 x 2.57mm METALLIZATION: Type: AlSi Å Å Metal Thickness: 11k 1k GLASSIVATION: Type: SiO 2 Å Å Thickness: 13k 2.6k WORST CASE CURRENT DENSITY 2 A/cm BOND ...