T89C5115_08 ATMEL [ATMEL Corporation], T89C5115_08 Datasheet - Page 97
T89C5115_08
Manufacturer Part Number
T89C5115_08
Description
Low Pin Count 8-bit Microcontroller with A/D Converter and 16 KBytes Flash Memory
Manufacturer
ATMEL [ATMEL Corporation]
Datasheet
1.T89C5115_08.pdf
(113 pages)
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Electrical Characteristics
Absolute Maximum Ratings*
DC Parameters for
Standard Voltage
T
Table 72. DC Parameters in Standard Voltage
Notes:
4128G–8051–02/08
I = industrial ....................................................... -40°C to 85°C
Storage Temperature ................................... -65°C to + 150°C
Voltage on V
Voltage on Any Pin from V
Power Dissipation ............................................................. 1 W
A
Symbol
= -40°C to +85°C; V
V
R
V
V
C
V
V
IH1
I
I
I
I
I
RST
PD
CC
TL
OH
IL
LI
OL
IH
IO
IL
(2)
1. Typicals are based on a limited number of samples and are not guaranteed. The values listed are at room temperature.
2. Flash retention is guaranteed with the same formula for V
Parameter
Input Low Voltage
Input High Voltage except XTAL1, RST
Input High Voltage, XTAL1, RST
Output Low Voltage, ports 1, 2, 3 and 4
Output High Voltage, ports 1, 2, 3, 4 and 5
RST Pulldown Resistor
Logical 0 Input Current ports 1, 2, 3 and 4
Input Leakage Current
Logical 1 to 0 Transition Current, ports 1, 2, 3
and 4
Capacitance of I/O Buffer
Power-down Current
Power Supply Current
CC
from V
SS
SS
.....................................-0.5V to + 6V
SS
= 0 V; V
.....................-0.5V to V
CC
= 3 volts to 5.5 volts; F = 0 to 40 MHz
(3)
CC
+ 0.2V
0.2 V
ICC_FLASH_WRITE
V
V
V
0.7 V
CC
CC
CC
Min
-0.5
CC
50
- 0.3
- 0.7
- 1.5
I
CC
*NOTICE:
+ 0.9
I
CCIDLE
CCOP
CC
= 0.7 Freq (MHz) + 3 mA
= 0.6 Freq (MHz) + 2 mA
min down to 0V.
Typ
160
(7)
mA
90
S
lute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only
and functional operation of the device at these or
any other conditions above those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Power Dissipation value is based on the maxi-
mum allowable die temperature and the thermal
resistance of the package.
(1)
=0.4 Freq (MHz) + 20
tresses at or above those listed under “Abso-
0.2Vcc - 0.1
V
V
CC
CC
Max
-650
0.45
200
400
±10
0.3
1.0
-50
10
+ 0.5
+ 0.5
Unit
kΩ
µA
µA
µA
pF
µA
V
V
V
V
V
V
V
V
V
I
I
I
I
I
I
V
Vin = 0.45V
0.45V < Vin < V
Vin = 2.0V
Fc = 1 MHz
T
3V < V
3V < V
OL
OL
OL
OH
OH
OH
A
CC
= 25°C
= 100 µA
= 1.6 mA
= 3.5 mA
= -10 µA
= -30 µA
= -60 µA
= 5V ± 10%
Test Conditions
CC
CC
< 5.5V
< 5.5V
CC
(4)
(1)(2)
97
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