STR750FXX STMICROELECTRONICS [STMicroelectronics], STR750FXX Datasheet - Page 5
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STR750FXX
Manufacturer Part Number
STR750FXX
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.STR750FXX.pdf
(81 pages)
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3
3.1
Introduction
This Datasheet contains the description of the STR750F family features, pinout, Electrical
Characteristics, Mechanical Data and Ordering information.
For complete information on the Microcontroller memory, registers and peripherals. Please
refer to the STR750F Reference Manual.
For information on the ARM7TDMI-S core please refer to the ARM7TDMI-S Technical
Reference Manual available from Arm Ltd.
For information on programming, erasing and protection of the internal Flash memory
please refer to the STR7 Flash Programming Reference Manual
For information on third-party development tools, please refer to the http://www.st.com/mcu
website.
Functional description
The STR750F family includes devices in 2 package sizes: 64-pin and 100-pin. Both types
have the following common features:
ARM7TDMI-S
STR750F family has an embedded ARM core and is therefore compatible with all ARM tools
and software. It combines the high performance ARM7TDMI-S
range of peripheral functions and enhanced I/O capabilities. All devices have on-chip high-
speed single voltage FLASH memory and high-speed RAM.
Figure 1
Embedded Flash Memory
Up to 256 KBytes of embedded Flash is available in Bank 0 for storing programs and data.
An additional Bank 1 provides 16 Kbytes of RWW (Read While Write) memory allowing it to
be erased/programmed on-the-fly. This partitioning feature is ideal for storing application
parameters.
●
●
Embedded SRAM
16 Kbytes of embedded SRAM accessed (read/write) at CPU clock speed with 0 wait states.
Enhanced Interrupt Controller (EIC)
In addition to the standard ARM interrupt controller, the STR750F embeds a nested interrupt
controller able to handle up to 32 vectors and 16 priority levels. This additional hardware
block provides flexible interrupt management features with minimal interrupt latency.
When configured in burst mode, access to Flash memory is performed at CPU clock
speed with 0 wait states for sequential accesses and 1 wait state for random access
(maximum 60 MHz).
When not configured in burst mode, access to Flash memory is performed at CPU
clock speed with 0 wait states (maximum 32 MHz)
shows the general block diagram of the device family.
TM
core with embedded Flash & RAM
TM
CPU with an extensive
Introduction
5/81
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