BH33FB1WG ROHM [Rohm], BH33FB1WG Datasheet - Page 5

• Manufacturer Part Number: BH33FB1WG
• Description: CMOS Type series regulator
• Manufacturer: ROHM [Rohm]

2.
* Circuit design should allow a sufficient margin for the temperature range so that P
Power dissipation
1. Power dissipation
Block diagrams
Power dissipation Pd
Power Dissipation Reduction (Example)
Power dissipation calculation include estimates of power dissipation characteristics and internal IC power consumption
and should be treated as guidelines. In the event that the IC is used in an environment where this power dissipation is
exceeded, the attendant rise in the junction temperature will trigger the thermal shutdown circuit, reducing the current
capacity and otherwise degrading the IC's design performance. Allow for sufficient margins so that this power dissipation
is not exceeded during IC operation.
Calculating the maximum internal IC power consumption (P
Fig. 26: HVSOF6
Power Dissipation/
Board: 70 mm
Material: Glass epoxy PCB
characteristics (Pd)
°
X
70 mm
X
1.6 mm
Power Dissipation Reduction (Example)
Fig. 27: HVSOF5
Power Dissipation/
Board: 70 mm
Material: Glass epoxy PCB
°
MAX
X
70 mm
)
X
1.6 mm
MAX
Input voltage
Output voltage
Output current
< Pd.
Terminal No. Terminal Name Function
Power Dissipation Reduction (Example)
Output voltage ON/OFF control
(High: ON, Low: OFF)
Ground
Power supply input
Voltage output
NO CONNECT
Power supply input
Ground
Output voltage ON/OFF control
(High: ON, Low: OFF)
NO CONNECT
Voltage output
Power supply input
Voltage output
Voltage output
Noise reducing capacitor
ground terminal
Ground
Output voltage ON/OFF control
(High: ON, Low: OFF)
Power Dissipation/
Board: 70 mm
Material: Glass epoxy PCB
Fig. 28: SSOP5
°
X
70 mm
X
1.6 mm